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LIS244ALHTR

STMicroelectronics

LIS244ALHTR by STMicroelectronics

LIS244ALHTR by STMicroelectronics is a CMOS analog circuit with a 3.3V supply voltage and operates in extreme temperatures from -40 °C to 85 °C. It features a square, no-lead chip carrier package with 16 terminals. Ideal for industrial applications requiring reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 34,713 parts In-Stock

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Vyrian

USA . 8,072 parts In-Stock

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Anansix

USA . 2,571 parts In-Stock

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Digiode

USA . 1,482 parts In-Stock

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1,482

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AZTECH Wire

Italy . 1,127 parts In-Stock

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$8.950

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1,127

$8.950

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IDEA Electronic Components Group

UK . 776 parts In-Stock

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$18.143

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$16.329

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776

$18.143

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$16.329

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MKK Technologies

India . 279 parts In-Stock

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$34.117

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279

$34.117

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DigiPath Technology Company

USA . 279 parts In-Stock

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$34.117

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279

$34.117

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Kepictronics

USA . 36,713 parts In-Stock

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Corphita

USA . 4,471 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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Parana Technologies

USA . 244 parts In-Stock

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$21.693

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$21.693

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Overview

Unlock unparalleled performance and reliability with the LIS244ALHTR from STMicroelectronics. Renowned for their cutting-edge technology and exceptional quality, STMicroelectronics delivers a high-performance solution perfect for automotive, industrial, and consumer applications. This compact, surface-mount device ensures efficient power management and resilience in varying temperatures, making it an ideal choice for demanding environments. Elevate your projects with a trusted partner that prioritizes innovation and customer satisfaction!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a balance of performance and cost, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for automated assembly, reducing manufacturing costs and improving reliability.

Package Shape: SQUARE

A square package shape optimizes the layout on PCBs, making it easier to design compact electronic systems.

Nominal Supply Voltage (Vsup): 3.3 V

3.3 V operation is standard in many digital applications, enhancing compatibility with various components.

Power Supplies (V): 3.3

Consistent voltage specification ensures reliable performance in power-sensitive applications.

No. of Terminals: 16

With 16 terminals, this IC provides enough I/O connections for complex circuits while maintaining a compact form factor.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient thermal dissipation and performance optimization in high-frequency applications.

Maximum Operating Temperature: 85 °C

An operating temperature ceiling of 85 °C makes this product suitable for industrial applications with moderate heat exposure.

Minimum Operating Temperature: -40 °C

A wide temperature range from -40 °C makes this IC ideal for harsh environments, including outdoor and automotive use.

Terminal Finish: NICKEL GOLD

Nickel gold finishing provides excellent solderability and long-term reliability, reducing oxidation-related failures.

Terminal Position: QUAD

Quad terminal position improves layout flexibility and routing on printed circuit boards.

Other IC type: ANALOG CIRCUIT

As an analog circuit IC, it can handle continuous signals, making it essential for various analog processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures that the semiconductor can withstand manufacturing processes without damage.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C contributes to strong interconnections during soldering, enhancing overall durability.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in demanding environments, making it suitable for a wide range of applications.

Technology: CMOS

Using CMOS technology allows for low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead design offers space savings and contributes to a lower environmental impact by reducing lead usage.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch facilitates compact designs while still enabling reliable connections in high-density layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand standard soldering processes while requiring careful handling to avoid moisture damage.

Technical Specifications

Other Function Semiconductors LIS244ALHTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LIS244ALHTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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