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LIS244ALH

STMicroelectronics

LIS244ALH by STMicroelectronics

LIS244ALH by STMicroelectronics is a CMOS analog circuit with a 3.3V supply, designed for industrial applications. It features a compact square chip carrier package with 16 terminals and operates b/w -40 °C to 85 °C. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,697 parts In-Stock

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5,697

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Anansix

USA . 1,318 parts In-Stock

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1,318

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Digiode

USA . 847 parts In-Stock

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847

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,626 parts In-Stock

1+ parts

$5.647

100+ parts

-

1k+ parts

$5.082

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1,626

$5.647

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$5.082

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MKK Technologies

India . 2,363 parts In-Stock

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$10.619

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2,363

$10.619

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DigiPath Technology Company

USA . 2,363 parts In-Stock

1+ parts

$10.619

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2,363

$10.619

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AZTECH Wire

Italy . 193 parts In-Stock

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$12.640

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193

$12.640

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Assy Fe

Spain . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 5,928 parts In-Stock

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5,928

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Alle Elektronik GmbH

Germany . 3,952 parts In-Stock

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3,952

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Parana Technologies

USA . 2,338 parts In-Stock

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$6.752

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2,338

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$6.752

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Corphita

USA . 1,492 parts In-Stock

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1,492

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Overview

Elevate your projects with the LIS244ALH from STMicroelectronics, a trusted leader in semiconductor innovation. This advanced analog circuit delivers reliable performance across diverse applications, ensuring optimal functionality in demanding environments. With its robust design and exceptional temperature tolerance, you'll enjoy peace of mind knowing you're investing in quality. Maximize efficiency and minimize downtime, enhancing your product's value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, enhancing manufacturing efficiency.

Package Shape: SQUARE

The square package shape optimizes space on PCBs, providing flexibility in layout design for various applications.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at 3.3V aligns with standard digital logic levels, making it compatible with a wide range of devices.

Power Supplies (V): 3.3

This specification indicates low power consumption, which is crucial for energy-efficient designs.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities, which is advantageous for complex circuitry.

Package Style (Meter): CHIP CARRIER

Chip carrier packages provide excellent thermal and electrical performance, ideal for high-frequency applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial environments where heat is a concern.

Minimum Operating Temperature: -40 °C

Operating as low as -40 °C ensures reliability in diverse and harsh environmental conditions.

Terminal Finish: NICKEL GOLD

Nickel-gold finish provides excellent solderability and corrosion resistance, ensuring long-term performance.

Terminal Position: QUAD

The quad terminal position enables efficient PCB routing and design, enhancing overall space utilization.

Other IC type: ANALOG CIRCUIT

Being an analog circuit makes this device suitable for a variety of applications requiring precise signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds minimizes thermal stress, protecting sensitive components during soldering.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature ensures compatibility with modern soldering techniques used in electronics manufacturing.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this component meets rigorous performance standards needed for a range of demanding conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

No-lead terminals facilitate smaller footprints and more efficient thermal performance, beneficial for compact designs.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for higher density packaging while still enabling reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that this product can withstand moisture exposure during assembly, making it suitable for standard handling processes.

Technical Specifications

Other Function Semiconductors LIS244ALH attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LIS244ALH Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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