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LIS2DE

STMicroelectronics

LIS2DE by STMicroelectronics

LIS2DE by STMicroelectronics is a compact, industrial-grade accelerometer with a supply voltage range of 1.71V to 3.6V. It features a very thin profile (1mm max height) and operates in temperatures from -40 °C to 85 °C. Ideal for motion sensing in various applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,203 parts In-Stock

1+ parts

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4,203

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Anansix

USA . 2,110 parts In-Stock

1+ parts

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2,110

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Digiode

USA . 250 parts In-Stock

1+ parts

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 363 parts In-Stock

1+ parts

$5.428

100+ parts

-

1k+ parts

$4.885

10k+ parts

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363

$5.428

-

$4.885

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MKK Technologies

India . 991 parts In-Stock

1+ parts

$10.207

100+ parts

-

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991

$10.207

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DigiPath Technology Company

USA . 991 parts In-Stock

1+ parts

$10.207

100+ parts

-

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991

$10.207

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Corphita

USA . 2,797 parts In-Stock

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2,797

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Parana Technologies

USA . 2,147 parts In-Stock

1+ parts

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100+ parts

$6.490

1k+ parts

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2,147

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$6.490

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Overview

Unlock the potential of your designs with the LIS2DE from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile sensor delivers exceptional performance in diverse applications, from industrial automation to consumer electronics. With its compact size and robust temperature tolerance, the LIS2DE ensures reliability and efficiency, helping you create smarter products that stand out in a competitive market. Elevate your projects with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improved production efficiency, making it a great option for modern electronic devices.

Package Shape: SQUARE

A square package shape facilitates efficient layout design on PCBs, optimizing space usage in electronic assemblies.

Nominal Supply Voltage (Vsup): 2.5 V

Operating at a nominal voltage of 2.5 V allows for energy-efficient performance, crucial for battery-operated devices.

No. of Terminals: 14

With 14 terminals, this IC offers multiple connections, providing flexibility and functionality for complex circuits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile help in high-density applications, crucial for modern electronics where space is limited.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in challenging conditions, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for applications in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal positioning enables seamless integration into circuit boards, enhancing the overall layout and design.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm contributes to a low-profile design, essential for compact electronic devices.

Width: 2 mm

The 2 mm width allows for tight spacing in multi-chip modules, maintaining the compactness and reducing PCB area.

Other IC type: ANALOG CIRCUIT

Being an analog circuit IC provides versatility for signal processing applications, a valuable asset for many electronic designs.

Minimum Supply Voltage (Vsup): 1.71 V

A minimum supply voltage of 1.71 V permits operation in lower power environments, enhancing energy efficiency.

Length: 2 mm

The compact 2 mm length facilitates integration into space-constrained designs, perfect for modern applications.

Temperature Grade: INDUSTRIAL

Designed for industrial grade applications, this IC ensures reliability and performance under rigorous environmental conditions.

Terminal Form: BUTT

Butt terminal form provides reliable electrical connections while simplifying PCB design and assembly processes.

Terminal Pitch: 0.35 mm

A 0.35 mm terminal pitch allows for high-density packaging, making it ideal for advanced electronics needing minimized board space.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6 V, this IC is versatile enough to cater to a range of applications requiring variable power.

Technical Specifications

Other Function Semiconductors LIS2DE attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B14

Length:

2 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2 mm

Trade Compliance

LIS2DE Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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