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LIS244ALTR

STMicroelectronics

LIS244ALTR by STMicroelectronics

LIS244ALTR by STMicroelectronics is a low-profile motion sensor with a supply voltage range of 2.4V to 3.6V and operates b/w -40 °C to 85°C. It features a compact 4mm x 4mm square package with 16 terminals for easy surface mounting. Ideal for industrial applications, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,419 parts In-Stock

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2,419

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Vyrian

USA . 2,295 parts In-Stock

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2,295

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Anansix

USA . 1,255 parts In-Stock

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1,255

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Rebound Electronics

UK . 866 parts In-Stock

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866

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,811 parts In-Stock

1+ parts

$2.504

100+ parts

-

1k+ parts

$2.254

10k+ parts

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1,811

$2.504

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$2.254

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MKK Technologies

India . 441 parts In-Stock

1+ parts

$4.709

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441

$4.709

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DigiPath Technology Company

USA . 441 parts In-Stock

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$4.709

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441

$4.709

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AZTECH Wire

Italy . 860 parts In-Stock

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$8.520

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860

$8.520

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Corphita

USA . 3,930 parts In-Stock

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3,930

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 254 parts In-Stock

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$2.994

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254

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$2.994

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Unlock a new level of innovation with the LIS244ALTR from STMicroelectronics! This exceptional motion sensor combines industry-leading quality and durability, making it perfect for a wide range of applications—from smart home devices to industrial automation. With its compact design and impressive temperature resilience, you can rely on it for performance in diverse environments. Choose STMicroelectronics for unparalleled reliability and elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy allows for lightweight and durable construction, enhancing the product's reliability in various applications.

Surface Mount: YES

Surface mount capability permits high-density circuit designs, saving space on PCBs and enabling more compact device architectures.

Package Shape: SQUARE

The square shape is conducive for uniform heat distribution and efficient space usage on printed circuit boards.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3V is widely compatible with many low-power applications, making it ideal for battery-operated devices.

No. of Terminals: 16

Having 16 terminals provides flexibility for various connection configurations, enabling diverse functionality in designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile grid array design allows for excellent thermal performance and space-saving advantages in electronic assemblies.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial environments, ensuring reliability under elevated temperatures.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme cold conditions, making it versatile for various applications.

Terminal Finish: NICKEL GOLD

Nickel-gold finish provides excellent corrosion resistance and improved solderability, which enhances the longevity and reliability of connections.

Terminal Position: BOTTOM

Bottom-terminal positioning contributes to a lower profile and enables efficient thermal dissipation in densely packed assemblies.

Maximum Seated Height: 1.6 mm

With a maximum seated height of just 1.6 mm, this product is ideal for applications where compactness is a priority.

Width (mm): 4 mm

The compact width of 4 mm makes this product suitable for integration into small devices and systems with space constraints.

Other IC type: MOTION SENSOR

As a motion sensor, this IC is essential for applications like automation and security, adding valuable functionality to electronic systems.

Minimum Supply Voltage (Vsup): 2.4 V

Operating at a minimum supply voltage of 2.4V allows for flexibility in power supply designs, accommodating diverse energy sources.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow temperature time of 30 seconds ensures compatibility with standard soldering processes, making assembly easier.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates the component can withstand high-temperature soldering processes, enhancing reliability.

Length: 4 mm

A length of 4 mm ensures that the component can be integrated into compact PCB layouts, perfect for space-sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade means this product can operate reliably in harsh environments, suitable for manufacturing and industrial applications.

Technology: CMOS

The CMOS technology used in this product enables low power consumption while supporting high-speed operations, ideal for modern electronic devices.

Terminal Form: BALL

Ball terminal form enhances solder joint strength and reliability, aiding in stable connections in various environments.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density mounting without compromising signal integrity, accommodating complex circuit designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the part is moderately sensitive to moisture, helping users plan appropriate handling and storage practices.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product can safely operate in a broad range of applications without risk of damage.

Technical Specifications

Other Function Semiconductors LIS244ALTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LIS244ALTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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