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L9380-TR

STMicroelectronics

L9380-TR by STMicroelectronics

L9380-TR by STMicroelectronics is a versatile MOSFET gate driver with a max supply voltage of 18.5V and supports high-side driving. It features a compact 20-terminal package, ideal for space-constrained applications. This driver operates efficiently b/w 7V to 18.5V, making it suitable for various power management tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,163 parts In-Stock

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11,163

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ComSIT Distribution GmbH

Germany . 2,896 parts In-Stock

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2,896

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Digiode

USA . 2,294 parts In-Stock

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2,294

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Anansix

USA . 633 parts In-Stock

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633

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 273 parts In-Stock

1+ parts

$3.900

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273

$3.900

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IDEA Electronic Components Group

UK . 780 parts In-Stock

1+ parts

$9.120

100+ parts

-

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$8.208

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780

$9.120

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$8.208

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AZTECH Wire

Italy . 491 parts In-Stock

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$10.330

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491

$10.330

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MKK Technologies

India . 1,318 parts In-Stock

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$17.149

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1,318

$17.149

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DigiPath Technology Company

USA . 1,318 parts In-Stock

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$17.149

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1,318

$17.149

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Component Stockers USA

USA . 761 parts In-Stock

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$99.990

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761

$99.990

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,639 parts In-Stock

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1,639

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Parana Technologies

USA . 743 parts In-Stock

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$10.904

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743

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$10.904

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Overview

Unlock exceptional performance with the L9380-TR from STMicroelectronics—your go-to solution for efficient MOSFET gate driving. Renowned for their quality and innovation, STMicroelectronics brings you a versatile driver capable of handling multiple functions with ease. Ideal for automotive, industrial, and consumer electronics applications, this compact device offers reliability and superior power management, ensuring your designs operate at peak efficiency while maximizing value. Experience the advantage of cutting-edge technology that empowers your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures reliability and protection of the driver in various operating environments.

Surface Mount: YES

Surface mount capabilities allow for easier and more compact PCB designs, enhancing space efficiency in applications.

Maximum Supply Voltage: 18.5 V

A high maximum supply voltage allows for versatility in different circuit applications, accommodating a wide range of operating conditions.

No. of Functions: 3

Multiple functions enable this driver to control different components effectively, making it suitable for complex applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space usage on PCBs, making design integration simpler.

Power Supplies (V): 7/18.5

Supports a broad input voltage range for flexible integration into various circuits and applications.

No. of Terminals: 20

With 20 terminals, the driver provides ample connection options for comprehensive functionality and complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint on the circuit board, which is ideal for space-constrained applications.

Minimum Supply Voltage: 7 V

A low minimum supply voltage ensures compatibility with low-power applications, increasing its usability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish enhances corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexible routing and improved layout on PCBs, accommodating various design needs.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a slim profile, making the driver suitable for compact electronic devices.

Width: 7.5 mm

A moderate width enables easy integration in various layout designs while maintaining a robust connection.

High Side Driver: YES

High side driving capability allows the driver to control high-side MOSFETs directly, which is crucial for many power management applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates compatibility with standard soldering processes, ensuring ease of manufacturing.

Peak Reflow Temperature °C: 260

A high peak reflow temperature rating means this driver can withstand the demands of high-temperature soldering processes.

Length: 12.8 mm

The length of the package strikes a balance between compactness and functionality, fitting well in diverse applications.

Terminal Form: GULL WING

Gull wing terminal design simplifies assembly and enhances solder joint reliability, contributing to overall product durability.

Nominal Supply Voltage: 14 V

The nominal supply voltage represents a standard operating condition, optimizing performance in typical use cases.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easier handling and placement during PCB assembly.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, guiding proper storage and handling for reliability.

Nominal Output Peak Current Limit: 0.005 A

The output peak current limit is suitable for driving small loads, making it applicable in low-power circuits.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

This type of interface provides flexibility in design, enabling designers to effectively drive MOSFETs in various configurations.

Technical Specifications

MOSFET Gate Drivers L9380-TR attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

20

Nominal Output Peak Current Limit:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/18.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

18.5 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

L9380-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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