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2EDS8265HXUMA1

Infineon Technologies

2EDS8265HXUMA1 by Infineon Technologies

2EDS8265HXUMA1 by Infineon Technologies is a MOSFET Gate Driver with a max supply voltage of 20V and a min operating temperature of -40°C. It is commonly used in industrial applications as a half bridge based MOSFET driver.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 432 parts In-Stock

1+ parts

$3.220

100+ parts

$1.870

1k+ parts

$1.570

10k+ parts

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432

$3.220

$1.870

$1.570

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Newark

USA . 39 parts In-Stock

1+ parts

$4.240

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39

$4.240

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Element14

Singapore . 546 parts In-Stock

1+ parts

-

100+ parts

$3.018

1k+ parts

$2.161

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546

-

$3.018

$2.161

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 1,206 parts In-Stock

1+ parts

$1.937

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1,206

$1.937

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$2.509

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650

$2.509

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Digiode

USA . 585 parts In-Stock

1+ parts

$3.914

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585

$3.914

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Vyrian

USA . 4,419 parts In-Stock

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4,419

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VNN

France . 4,266 parts In-Stock

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4,266

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,847 parts In-Stock

1+ parts

$2.509

100+ parts

-

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4,847

$2.509

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Netroflash

USA . 500 parts In-Stock

1+ parts

$2.509

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500

$2.509

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Ampacity Inc.

Singapore . 399 parts In-Stock

1+ parts

$2.570

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399

$2.570

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Semicontronic

India . 157 parts In-Stock

1+ parts

$2.570

100+ parts

$2.506

1k+ parts

$2.493

10k+ parts

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157

$2.570

$2.506

$2.493

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.911

100+ parts

$2.678

1k+ parts

$2.509

10k+ parts

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2,500

$2.911

$2.678

$2.509

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Aztec Data Supply Inc.

USA . 1,277 parts In-Stock

1+ parts

$2.980

100+ parts

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1,277

$2.980

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Corphita

USA . 760 parts In-Stock

1+ parts

$3.708

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760

$3.708

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Component Stockers USA

USA . 853 parts In-Stock

1+ parts

$3.990

100+ parts

$2.940

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853

$3.990

$2.940

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Continental Prestige Electronics

USA . 849 parts In-Stock

1+ parts

$4.040

100+ parts

$2.680

1k+ parts

$2.230

10k+ parts

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849

$4.040

$2.680

$2.230

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Corohmni

South Africa . 214 parts In-Stock

1+ parts

$11.793

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214

$11.793

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Modulus Dynamics

Lithuania . 3,274 parts In-Stock

1+ parts

$13.550

100+ parts

$13.008

1k+ parts

$12.466

10k+ parts

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3,274

$13.550

$13.008

$12.466

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Microchip USA

USA . 4,769 parts In-Stock

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4,769

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Introducing the 2EDS8265HXUMA1 by Infineon Technologies, the ultimate solution for your MOSFET gate driver needs. With its high-quality manufacturing and superior design, this product offers unmatched performance and reliability. Whether you're working in the industrial or automotive sector, this small outline package will revolutionize your applications. Experience seamless integration with its surface mount feature and enjoy the benefits of a wide temperature range, making it perfect for any environment. Trust Infineon Technologies to deliver exceptional value and advantages to meet all your demands. Upgrade your projects today with the 2EDS8265HXUMA1!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the package, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.5 V

With a maximum supply voltage of 3.5V, this gate driver is compatible with a wide range of low voltage applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the PCB, optimizing space utilization.

Maximum Supply Voltage-1: 20 V

Ability to handle a maximum supply voltage of 20V makes this gate driver versatile for different voltage requirements.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the gate driver to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and facilitates compact design layouts.

Minimum Supply Voltage-1: 4.5 V

Low minimum supply voltage requirement of 4.5V ensures operation in low voltage conditions.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement of 3V makes this gate driver suitable for a range of low voltage applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this gate driver is suitable for use in extreme cold environments.

Terminal Position: DUAL

Dual terminal position allows for easier connection and flexibility in circuit design.

Maximum Seated Height: 2.65 mm

Low maximum seated height of 2.65mm helps in achieving a compact overall profile of the PCB.

Width: 7.5 mm

Narrow width of 7.5mm helps in optimizing space utilization on the PCB.

High Side Driver: YES

Being a high side driver, this gate driver can drive the high side of the MOSFET efficiently for improved performance.

Length: 10.3 mm

Compact length of 10.3mm contributes to an overall compact design of the gate driver.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability in connecting the gate driver to the PCB.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V makes this gate driver efficient for various power supply applications.

Turn-on Time: 0.044 us

Fast turn-on time of 0.044us ensures quick response and efficient operation of the gate driver.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm allows for easy connection and layout on the PCB.

Nominal Supply Voltage-1: 12 V

Nominal supply voltage of 12V makes this gate driver suitable for medium voltage applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that this gate driver can withstand moderate humidity levels during operation.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half bridge based MOSFET driver interface IC type allows for efficient control of MOSFETs in half bridge configurations.

Turn-off Time: 0.044 us

Fast turn-off time of 0.044us ensures quick response and efficient switching of the MOSFETs in the circuit.

Technical Specifications

MOSFET Gate Drivers 2EDS8265HXUMA1 attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

3.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

20 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.044 us

Turn-on Time:

.044 us

Width:

7.5 mm

Trade Compliance

2EDS8265HXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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