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2EDS8165HXUMA1

Infineon Technologies

2EDS8165HXUMA1 by Infineon Technologies

2EDS8165HXUMA1 by Infineon Technologies is a MOSFET gate driver with a small outline package and dual terminals. It operates in industrial temperatures from -40 to 85°C, with a supply voltage range of 3-3.5V. Ideal for applications requiring high side drivers and fast turn-on/off times of 0.044 us.

Median Price

$2.081

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$2.081

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$2.081

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Vyrian

USA . 7,624 parts In-Stock

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7,624

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VNN

France . 2,505 parts In-Stock

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Digiode

USA . 951 parts In-Stock

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,669 parts In-Stock

1+ parts

$2.081

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$2.039

4,669

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$2.039

Argo Parts USA

USA . 3,695 parts In-Stock

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$2.081

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Netroflash

USA . 50 parts In-Stock

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$2.081

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$1.977

10k+ parts

$1.935

50

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$1.977

$1.935

Aztec Data Supply Inc.

USA . 3,762 parts In-Stock

1+ parts

$4.090

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$4.090

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Modulus Dynamics

Lithuania . 2,268 parts In-Stock

1+ parts

$6.156

100+ parts

$5.910

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$5.664

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2,268

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$5.664

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Ampacity Inc.

Singapore . 1,102 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 728 parts In-Stock

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$10.458

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Corohmni

South Africa . 21 parts In-Stock

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$12.399

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Perfect Parts

USA . 4,480 parts In-Stock

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Microchip USA

USA . 2,008 parts In-Stock

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Corphita

USA . 818 parts In-Stock

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Overview

Elevate your electronics with the 2EDS8165HXUMA1 by Infineon Technologies, a top-tier manufacturer known for cutting-edge technologies. This MOSFET Gate Driver is designed to maximize performance and efficiency, making it ideal for industrial applications where reliability is key. With a small outline package and dual terminal position, this driver offers ease of use and flexibility in design. Trust Infineon Technologies to deliver quality products that exceed expectations and elevate your projects to new heights. Upgrade to the 2EDS8165HXUMA1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making it efficient for compact designs.

Maximum Supply Voltage: 3.5 V

The high maximum supply voltage ensures reliable performance and compatibility with various power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit designs and provides stability during operation.

No. of Terminals: 16

With 16 terminals, this MOSFET gate driver offers versatility in connecting to other components and enables complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact footprint, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures flexibility in power source options and energy efficiency during operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure long-term reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for use in extreme temperature environments without compromising performance.

Terminal Position: DUAL

The dual terminal position offers redundancy in connections, enhancing reliability and ensuring consistent performance.

Maximum Seated Height: 2.65 mm

The low maximum seated height makes the product suitable for compact designs and allows for efficient heat dissipation.

Width: 7.5 mm

The moderate width of the product facilitates easy installation and compatibility with standard PCB layouts.

High Side Driver: YES

The inclusion of a high side driver enhances the efficiency and performance of the MOSFET gate driver in various circuit configurations.

Length: 10.3 mm

The moderate length of the product ensures compatibility with standard PCB dimensions and offers enough space for mounting.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial applications with varying temperature conditions.

Terminal Form: GULL WING

The gull-wing terminal form provides strong mechanical connections and ease of soldering for reliable performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power sources and allows for stable operation.

Turn-on Time: 0.044 us

The fast turn-on time of 0.044 us ensures quick response and precise control of the MOSFET switching process for efficient operation.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting and efficient use of PCB space in tight layouts.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate sensitivity to moisture, ensuring reliability in humid environments with proper handling and storage.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

The half bridge-based interface IC type provides efficient driver functionality for MOSFETs, enabling precise control and high performance in various applications.

Turn-off Time: 0.044 us

The fast turn-off time of 0.044 us ensures quick switching and minimizes power loss, contributing to the overall efficiency of the MOSFET gate driver.

Technical Specifications

MOSFET Gate Drivers 2EDS8165HXUMA1 attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES WITH OUTPUT SUPPLY VOLTAGE VDDA 4.5 TO 20

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

3.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.044 us

Turn-on Time:

.044 us

Width:

7.5 mm

Trade Compliance

2EDS8165HXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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