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L9380-TR-LF

STMicroelectronics

L9380-TR-LF by STMicroelectronics

L9380-TR-LF by STMicroelectronics is a versatile MOSFET gate driver with a max supply voltage of 18.5V, supporting high-side driving and featuring three functions. It comes in a compact 20-terminal SO package, ideal for space-constrained applications. With a nominal output peak current limit of 5mA, it efficiently drives MOSFETs in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,456 parts In-Stock

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5,456

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Digiode

USA . 3,635 parts In-Stock

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3,635

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Anansix

USA . 2,222 parts In-Stock

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2,222

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Distributors (Availability)

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Vigor

Singapore . 1,744 parts In-Stock

1+ parts

$1.750

100+ parts

-

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-

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1,744

$1.750

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AZTECH Wire

Italy . 185 parts In-Stock

1+ parts

$12.210

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185

$12.210

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

1+ parts

$12.751

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-

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$11.476

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1,606

$12.751

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$11.476

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Microchip USA

USA . 2,826 parts In-Stock

1+ parts

$12.977

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2,826

$12.977

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Advanced Electronics

New Zealand . 72 parts In-Stock

1+ parts

$14.501

100+ parts

$13.196

1k+ parts

$11.891

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72

$14.501

$13.196

$11.891

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MKK Technologies

India . 931 parts In-Stock

1+ parts

$23.978

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931

$23.978

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DigiPath Technology Company

USA . 931 parts In-Stock

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$23.978

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931

$23.978

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,941 parts In-Stock

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3,941

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Parana Technologies

USA . 2,078 parts In-Stock

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$15.246

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2,078

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$15.246

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Overview

Elevate your designs with the L9380-TR-LF from STMicroelectronics, renowned for its commitment to quality and innovation. This versatile MOSFET gate driver excels in efficiency, enabling seamless performance across countless applications, from automotive to industrial systems. Its compact design and robust functionality provide exceptional reliability while maximizing space. Choose STMicroelectronics for unparalleled value, enhanced performance, and peace of mind in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the driver against environmental factors.

Surface Mount: YES

The surface mount capability allows for easy integration into compact designs, enhancing space efficiency in PCB layouts.

Maximum Supply Voltage: 18.5 V

A high maximum supply voltage makes this driver suitable for applications requiring substantial voltage headroom.

No. of Functions: 3

Multiple functions in a single device can help reduce component count, streamline design, and improve reliability.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB space utilization and alignment during assembly.

Power Supplies (V): 7/18.5

The wide range of power supply voltages allows versatile application in varied power settings.

No. of Terminals: 20

The availability of many terminals facilitates multiple connections, which can enhance functional flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures compatibility with compact designs while maintaining performance.

Minimum Supply Voltage: 7 V

This minimum voltage requirement provides operational flexibility for low-voltage applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The durable terminal finish ensures reliable electrical connections and protects against oxidation.

Terminal Position: DUAL

Dual terminal positioning allows for a more efficient layout and easier routing in circuit designs.

Maximum Seated Height: 2.65 mm

A low seated height is ideal for low-profile applications, contributing to overall design integrity.

Width: 7.5 mm

The compact width makes it suitable for space-constrained applications, enhancing design versatility.

High Side Driver: YES

The inclusion of a high side driver enables better control of high-side switching applications.

Maximum Time At Peak Reflow Temperature: 30 s

This spec indicates reliability during soldering processes, ensuring minimal stress on components.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature capability supports compatibility with various soldering techniques.

Length: 12.8 mm

This moderate length provides a balance between compactness and functionality in various circuit layouts.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, improving assembly efficiency.

Nominal Supply Voltage: 14 V

A nominal supply voltage of 14V indicates optimal performance for a wide range of applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for various PCB designs, facilitating easy integration with existing layouts.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 allows for moderate handling; suitable for many manufacturing processes without special precautions.

Nominal Output Peak Current Limit: 0.005 A

This peak current limit ensures compatibility with low-power logic applications while providing ample drive capability.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter based design enhances signal integrity, making it ideal for various MOSFET applications.

Technical Specifications

MOSFET Gate Drivers L9380-TR-LF attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

20

Nominal Output Peak Current Limit:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/18.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

18.5 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

L9380-TR-LF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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