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L9380

STMicroelectronics

L9380 by STMicroelectronics

L9380 by STMicroelectronics is a MOSFET gate driver with 3 functions, operating at supply voltages of 7-18.5V. It features a small outline package style, Gull Wing terminal form, and is suitable for high side driver applications. With a max seated height of 2.65mm and peak reflow temperature of 260 °C, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,794 parts In-Stock

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3,794

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Anansix

USA . 2,411 parts In-Stock

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2,411

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Digiode

USA . 1,220 parts In-Stock

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1,220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 236 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

$3.305

10k+ parts

-

236

$3.672

-

$3.305

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MKK Technologies

India . 2,285 parts In-Stock

1+ parts

$6.904

100+ parts

-

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-

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2,285

$6.904

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DigiPath Technology Company

USA . 2,285 parts In-Stock

1+ parts

$6.904

100+ parts

-

1k+ parts

-

10k+ parts

-

2,285

$6.904

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AZTECH Wire

Italy . 666 parts In-Stock

1+ parts

$10.730

100+ parts

-

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666

$10.730

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Microchip USA

USA . 474 parts In-Stock

1+ parts

$14.780

100+ parts

-

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474

$14.780

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QUARKTWIN TECHNOLOGY LTD

USA . 10,043 parts In-Stock

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10,043

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Vigor

Singapore . 8,370 parts In-Stock

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8,370

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A-Z Elektronik GmbH

Germany . 6,099 parts In-Stock

1+ parts

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6,099

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Alle Elektronik GmbH

Germany . 4,066 parts In-Stock

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4,066

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Metaverse IC Inc.

Canada . 946 parts In-Stock

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946

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Parana Technologies

USA . 431 parts In-Stock

1+ parts

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$4.390

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431

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$4.390

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Kepictronics

USA . 400 parts In-Stock

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400

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Corphita

USA . 369 parts In-Stock

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369

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Overview

Unlock the potential of your power management systems with the L9380 MOSFET Gate Driver by STMicroelectronics. Designed with precision and reliability in mind, this high-quality component offers seamless integration and superior performance. Ideal for a wide range of applications, this driver provides enhanced efficiency and control. Trust in STMicroelectronics' legacy of excellence and revolutionize your designs with the L9380. Experience the value and benefits of this innovative product today.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount YES

Being surface mountable allows for easy and efficient installation of the MOSFET gate driver on a PCB, saving space and simplifying assembly.

Maximum Supply Voltage 18.5 V

The high maximum supply voltage of 18.5 V allows for compatibility with a wide range of power supply configurations, increasing flexibility in design.

No. of Functions 3

Having 3 functions in one unit simplifies the circuit design and reduces the number of components needed, saving space and cost.

Package Shape RECTANGULAR

The rectangular package shape is commonly used and facilitates easy integration into various electronic systems.

Power Supplies (V) 7/18.5

Support for multiple power supply voltages (7 V and 18.5 V) allows for versatile usage in different applications.

No. of Terminals 20

Having 20 terminals provides ample connection options and flexibility in circuit design.

Package Style (Meter) SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for applications with limited board real estate.

Minimum Supply Voltage 7 V

The low minimum supply voltage of 7 V ensures compatibility with a wide range of power sources, enhancing usability.

Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish enhances the product's reliability and ensures good electrical conductivity.

Terminal Position DUAL

Having dual terminal positions provides flexibility in PCB layout and facilitates better signal routing.

Maximum Seated Height 2.65 mm

The low maximum seated height of 2.65 mm helps in maintaining a slim profile for the overall assembly, especially in space-constrained applications.

Width 7.5 mm

The narrow width of 7.5 mm allows for compact placement on the PCB, optimizing space utilization.

High Side Driver YES

Having a high side driver functionality enables efficient and reliable control of high-side MOSFETs, essential for various power electronics applications.

Maximum Time At Peak Reflow Temperature (s) 30

With a maximum time of 30 seconds at peak reflow temperature, the product is easy to solder and mount onto the PCB without risking damage.

Peak Reflow Temperature °C 260

The high peak reflow temperature of 260 °C ensures stable and secure solder joints during assembly, enhancing overall reliability.

Length 12.8 mm

The moderate length of 12.8 mm offers a good balance between compactness and ease of handling during assembly.

Terminal Form GULL WING

The gull wing terminal form provides mechanical strength and secure contact with the PCB, ensuring reliable electrical connections.

Nominal Supply Voltage 14 V

The nominal supply voltage of 14 V is a common standard in many applications, ensuring compatibility and ease of integration.

Terminal Pitch 1.27 mm

The fine terminal pitch of 1.27 mm allows for high-density mounting on the PCB, enabling compact and efficient circuit layouts.

Moisture Sensitivity Level (MSL) 3

With a moisture sensitivity level of 3, the product is suitable for a wide range of environmental conditions and soldering processes.

Nominal Output Peak Current Limit 0.005 A

The nominal output peak current limit of 0.005 A ensures safe operation and protects the connected MOSFETs from excessive current.

Interface IC Type BUFFER OR INVERTER BASED MOSFET DRIVER

The interface IC type of buffer or inverter-based MOSFET driver offers flexibility in driving and controlling MOSFETs, meeting various application requirements.

Technical Specifications

MOSFET Gate Drivers L9380 attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

20

Nominal Output Peak Current Limit:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/18.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

18.5 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

L9380 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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