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L9380-LF

STMicroelectronics

L9380-LF by STMicroelectronics

L9380-LF by STMicroelectronics is a versatile MOSFET gate driver with a max supply voltage of 18.5V and supports high-side driving. It features a compact 20-terminal package, ideal for space-constrained applications. This driver operates efficiently b/w 7-18.5V, making it suitable for various power management tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,341 parts In-Stock

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6,341

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Digiode

USA . 1,770 parts In-Stock

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1,770

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Anansix

USA . 1,478 parts In-Stock

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1,478

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,343 parts In-Stock

1+ parts

$1.750

100+ parts

-

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1,343

$1.750

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IDEA Electronic Components Group

UK . 1,231 parts In-Stock

1+ parts

$13.553

100+ parts

-

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$12.197

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1,231

$13.553

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$12.197

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AZTECH Wire

Italy . 48 parts In-Stock

1+ parts

$21.870

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48

$21.870

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MKK Technologies

India . 957 parts In-Stock

1+ parts

$25.485

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957

$25.485

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DigiPath Technology Company

USA . 957 parts In-Stock

1+ parts

$25.485

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957

$25.485

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QUARKTWIN TECHNOLOGY LTD

USA . 23,574 parts In-Stock

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Microchip USA

USA . 3,691 parts In-Stock

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3,691

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Parana Technologies

USA . 2,263 parts In-Stock

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$16.204

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2,263

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$16.204

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Corphita

USA . 684 parts In-Stock

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684

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Overview

Unlock the potential of your designs with the L9380-LF from STMicroelectronics, a leader in advanced semiconductor solutions. This high-performance MOSFET gate driver enhances efficiency and reliability across diverse applications, from automotive to industrial control systems. With its compact design and robust capabilities, it ensures seamless integration while simplifying your circuit layout. Elevate your projects with the proven quality and innovation that STMicroelectronics is renowned for!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and resistance to moisture, making it suitable for a range of applications.

Surface Mount: YES

This allows for compact designs and simplifies the assembly process on PCBs, enhancing manufacturing efficiency.

Maximum Supply Voltage: 18.5 V

A high maximum supply voltage expands the range of applications this driver can support in various circuits.

No. of Functions: 3

Multiple functions offer versatility, allowing this driver to be used in different configurations and reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape is commonly used, facilitating easy integration into existing designs.

Power Supplies (V): 7/18.5

The wide range of supported supply voltages allows for flexibility in design, accommodating various system requirements.

No. of Terminals: 20

With 20 terminals, this component can support multiple connections and functions, contributing to more complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package helps save space on PCBs, an essential feature for compact devices.

Minimum Supply Voltage: 7 V

A minimum supply voltage of 7 V allows for compatibility with lower voltage systems, making it easier to integrate.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish enhances solderability and ensures reliable connections over time, which is critical in high-performance applications.

Terminal Position: DUAL

Dual terminal positioning simplifies routing and connections on the PCB layout, improving overall design efficiency.

Maximum Seated Height: 2.65 mm

A slim profile allows for applications where height is a constraint, making it ideal for compact systems.

Width: 7.5 mm

An optimal width ensures the device can fit into various layouts without occupying excessive space.

High Side Driver: YES

The inclusion of a high-side driver allows for driving loads connected to the power supply, which is crucial for many motor and load control applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a 30-second peak reflow time during soldering processes is indicative of the component's reliability and robustness.

Peak Reflow Temperature °C: 260

A high reflow temperature rating ensures compatibility with the latest surface-mount soldering technologies.

Length: 12.8 mm

This length provides a compact footprint that is advantageous for space-constrained designs.

Terminal Form: GULL WING

Gull wing terminals simplify assembly and enhance the mechanical stability of the component once soldered.

Nominal Supply Voltage: 14 V

A nominal supply voltage of 14 V is ideal for many automotive and industrial applications, ensuring high performance under typical operating conditions.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for more compact layouts and is compatible with dense PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of moisture sensitivity, ensuring necessary precautions are made during storage and assembly.

Nominal Output Peak Current Limit: 0.005 A

Providing a nominal output peak current limit of 0.005 A indicates it can efficiently drive small loads while protecting against overcurrent situations.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

This driver type allows for efficient switching of the MOSFETs, enabling reliable control and performance in various applications.

Technical Specifications

MOSFET Gate Drivers L9380-LF attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

20

Nominal Output Peak Current Limit:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/18.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

18.5 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

L9380-LF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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