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L9374XP

STMicroelectronics

L9374XP by STMicroelectronics

L9374XP by STMicroelectronics is a PWM-based peripheral driver with a nominal voltage of 38V and built-in protections against transients, thermal issues, and undervoltage. It features a compact 36-terminal design with gull-wing terminals. Ideal for automotive applications, it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,454

-

-

-

-

Anansix

USA . 466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

466

-

-

-

-

Vyrian

USA . 214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

214

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 795 parts In-Stock

1+ parts

$2.547

100+ parts

-

1k+ parts

$2.292

10k+ parts

-

795

$2.547

-

$2.292

-

MKK Technologies

India . 795 parts In-Stock

1+ parts

$4.789

100+ parts

-

1k+ parts

-

10k+ parts

-

795

$4.789

-

-

-

DigiPath Technology Company

USA . 795 parts In-Stock

1+ parts

$4.789

100+ parts

-

1k+ parts

-

10k+ parts

-

795

$4.789

-

-

-

Corphita

USA . 1,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,855

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-

-

-

Parana Technologies

USA . 1,390 parts In-Stock

1+ parts

-

100+ parts

$3.045

1k+ parts

-

10k+ parts

-

1,390

-

$3.045

-

-

Overview

Elevate your designs with the L9374XP from STMicroelectronics—a top-tier peripheral driver crafted for excellence. Renowned for its robust quality and reliability, STMicroelectronics empowers engineers with innovative solutions that enhance performance across applications like automotive, industrial automation, and consumer electronics. With built-in protections against transients, thermal issues, and under-voltage conditions, this compact driver ensures your systems run smoothly and efficiently. Unleash the full potential of your projects with the superior value and peace of mind that comes from choosing L9374XP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, ensuring a longer lifespan for the device.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern electronic assemblies.

Package Shape: RECTANGULAR

A rectangular package shape is advantageous for layout flexibility on printed circuit boards (PCBs), facilitating better space utilization.

Built-in Protections: TRANSIENT; THERMAL; UNDER VOLTAGE

These built-in protections enhance reliability and safety, preventing damage and improving performance in various operating conditions.

Power Supplies (V): 38

With a maximum power supply of 38V, this driver can handle high-performance tasks, making it suitable for a wide range of applications.

No. of Terminals: 36

Having 36 terminals provides ample connectivity options, allowing for complex configurations and greater versatility in designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package with a heat sink/slug design is ideal for thermal management, ensuring efficient heat dissipation in compact spaces.

Terminal Position: DUAL

Dual terminal positioning offers simplified layout options and can enhance the electrical performance by minimizing trace lengths.

Maximum Seated Height: 2.47 mm

A low maximum seated height contributes to the compactness of your design, making it ideal for space-constrained applications.

Width: 7.5 mm

The width of 7.5 mm aids in maintaining a slender profile for designs, which can facilitate more efficient packing of components.

Length: 10.3 mm

Compact length allows for integration into smaller systems without compromising performance, making it suitable for portable devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering reliability and ease of visual inspection, which is essential for high-quality manufacturing processes.

Nominal Supply Voltage: 38 V

A nominal supply voltage of 38V allows for consistent and reliable performance in applications requiring stable operation under varying loads.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports high-density PCB layouts, optimizing board space for more compact and efficient electronic designs.

Driver No. of Bits: 4

A 4-bit driver provides flexibility in controlling multiple outputs, making it suitable for various applications that require precise control.

Interface IC Type: PWM BASED PERIPHERAL DRIVER

PWM-based control offers fine resolution in output control, making it ideal for applications requiring smooth modulation and precise power delivery.

Technical Specifications

Peripheral Drivers L9374XP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

38

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

38 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

L9374XP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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