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L9374

STMicroelectronics

L9374 by STMicroelectronics

L9374 by STMicroelectronics is a PWM-based peripheral driver with built-in protections against transients, thermal issues, and undervoltage. It operates at a nominal voltage of 38V and features a compact 36-terminal design. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,336 parts In-Stock

1+ parts

-

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2,336

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Anansix

USA . 351 parts In-Stock

1+ parts

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-

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351

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Vyrian

USA . 290 parts In-Stock

1+ parts

-

100+ parts

-

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290

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 805 parts In-Stock

1+ parts

$4.107

100+ parts

-

1k+ parts

$3.696

10k+ parts

-

805

$4.107

-

$3.696

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MKK Technologies

India . 1,476 parts In-Stock

1+ parts

$7.723

100+ parts

-

1k+ parts

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10k+ parts

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1,476

$7.723

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DigiPath Technology Company

USA . 1,476 parts In-Stock

1+ parts

$7.723

100+ parts

-

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10k+ parts

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1,476

$7.723

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 4,161 parts In-Stock

1+ parts

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4,161

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Metaverse IC Inc.

Canada . 664 parts In-Stock

1+ parts

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664

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A-Z Elektronik GmbH

Germany . 117 parts In-Stock

1+ parts

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117

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Kepictronics

USA . 78 parts In-Stock

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78

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Parana Technologies

USA . 23 parts In-Stock

1+ parts

-

100+ parts

$4.910

1k+ parts

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10k+ parts

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23

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$4.910

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Overview

Unlock the potential of your applications with the L9374 from STMicroelectronics, a trusted leader in innovation. This powerful peripheral driver combines exceptional performance with built-in protections against transients, thermal issues, and undervoltage, ensuring reliability you can count on. Its compact design and efficient power handling make it perfect for diverse uses—from automotive to industrial automation. Choose the L9374 and experience unmatched quality and value that propel your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material offers good protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology provides a compact design, allowing for easy integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on printed circuit boards (PCBs).

Built-in Protections: TRANSIENT; THERMAL; UNDER VOLTAGE

These protections enhance the reliability and longevity of the product, safeguarding it from common electrical issues.

Power Supplies (V): 38

A high supply voltage capability supports a wide range of applications, including those requiring increased power.

No. of Terminals: 36

The ample number of terminals allows for multiple connections, increasing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style helps in effective heat dissipation and fits well in compact designs.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning offers versatility in layout and design configurations, simplifying PCB design.

Maximum Seated Height: 3.6 mm

A low profile height helps in minimizing the overall thickness of assemblies, which is ideal for slim devices.

Width: 11 mm

The compact width allows for efficient space management on PCBs, facilitating dense component placement.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates good thermal performance during soldering, reducing the risk of damage to components.

Peak Reflow Temperature °C: 245

A high peak reflow temperature allows compatibility with various soldering processes, ensuring solder joint integrity.

Length: 15.9 mm

A manageable length aids in fitting within tight spaces, making it suitable for compact electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide easy access for soldering, improving assembly efficiency.

Nominal Supply Voltage: 38 V

The nominal voltage reinforces operational stability under various conditions, ensuring consistent performance.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for densely packed components on the PCB, maximizing board space utilization.

Driver No. of Bits: 4

With 4 bits, the driver can control multiple functions or devices, enhancing the versatility of the peripheral driver.

Moisture Sensitivity Level (MSL): 3

This level indicates moderate sensitivity to moisture, guiding storage and handling protocols to ensure component reliability.

Interface IC Type: PWM BASED PERIPHERAL DRIVER

The PWM-based design provides efficient control for various peripheral devices, ideal for applications requiring precise signal modulation.

Technical Specifications

Peripheral Drivers L9374 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

38

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

38 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

L9374 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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