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L9377DIE1

STMicroelectronics

L9377DIE1 by STMicroelectronics

L9377DIE1 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V and supports up to 7A output current. It features built-in overcurrent and thermal protections, ensuring reliable operation. Ideal for buffer or inverter applications, it operates efficiently b/w 4.5V and 12V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,614 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,614

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-

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Digiode

USA . 4,330 parts In-Stock

1+ parts

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-

1k+ parts

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4,330

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Anansix

USA . 1,622 parts In-Stock

1+ parts

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10k+ parts

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1,622

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,159 parts In-Stock

1+ parts

$8.732

100+ parts

-

1k+ parts

$7.859

10k+ parts

-

1,159

$8.732

-

$7.859

-

MKK Technologies

India . 987 parts In-Stock

1+ parts

$16.419

100+ parts

-

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987

$16.419

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DigiPath Technology Company

USA . 987 parts In-Stock

1+ parts

$16.419

100+ parts

-

1k+ parts

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10k+ parts

-

987

$16.419

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Parana Technologies

USA . 965 parts In-Stock

1+ parts

-

100+ parts

$10.440

1k+ parts

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10k+ parts

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965

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$10.440

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Corphita

USA . 488 parts In-Stock

1+ parts

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488

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Overview

Elevate your designs with the L9377DIE1 from STMicroelectronics, a trusted leader in semiconductor innovation. This advanced peripheral driver is engineered for reliability, featuring robust built-in protections against overcurrent and thermal issues, ensuring seamless operation across various applications. With its compact no-lead design and efficient performance at varying supply voltages, the L9377DIE1 delivers exceptional value, enhancing device longevity while simplifying your development process. Choose quality, choose STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic circuits, saving space and simplifying the assembly process.

Maximum Supply Voltage: 32 V

With a maximum supply voltage of 32 V, this driver can be utilized in a wide range of applications, providing flexibility in system design.

No. of Functions: 2

Having two functions enhances the versatility of the device, enabling it to handle multiple operations or control sequences within a single component.

Built-in Protections: OVER CURRENT; THERMAL

The inclusion of over current and thermal protections ensures increased reliability and safety in operation, preventing damage to the device and connected components.

Package Style (Meter): UNCASED CHIP

The uncased chip package style is ideal for applications where space is limited and enables custom PCB designs for optimized performance.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, this driver can operate effectively in low-voltage applications, making it suitable for battery-powered devices.

Terminal Position: UPPER

An upper terminal position facilitates easier access for connections, improving the ease of use during installation and maintenance.

Technology: BCD

BCD technology provides high efficiency and reliability, allowing for lower power consumption while maintaining robust performance.

Terminal Form: NO LEAD

The no lead terminal form enhances the design's compactness, allowing for denser packing of components on the PCB and reducing material costs.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12 V makes this driver well-suited for standard electronic systems, ensuring compatibility with common components.

Turn-on Time: 25 us

A fast turn-on time of 25 microseconds ensures quick response in applications, facilitating effective control in dynamic environments.

Nominal Output Peak Current Limit: 7 A

With a peak current limit of 7 A, this driver can handle substantial loads, making it applicable in high-power use cases such as motors and solenoids.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This driver type provides compatibility with various interfacing needs and enhances signal integrity, making integration with other components straightforward.

Turn-off Time: 30 us

A turn-off time of 30 microseconds ensures efficient operation in switching applications, contributing to faster processing and minimal delays.

Output Current Flow Direction: SINK

The sink current configuration is particularly useful for controlling loads that require grounding, making this driver suitable for various actuator controls.

Technical Specifications

Peripheral Drivers L9377DIE1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

X-XUUC-N

No. of Functions:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

7 A

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

30 us

Turn-on Time:

25 us

Trade Compliance

L9377DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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