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L6918D

STMicroelectronics

L6918D by STMicroelectronics

L6918D by STMicroelectronics is a compact switching regulator with a max input voltage of 12V and operates at up to 1200 kHz. It features a dual terminal design in a small outline package, ideal for efficient power management in commercial applications. Its current-mode control ensures stable performance across temperatures from 0 °C to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,916 parts In-Stock

1+ parts

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4,916

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Anansix

USA . 1,468 parts In-Stock

1+ parts

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1,468

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Digiode

USA . 521 parts In-Stock

1+ parts

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521

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 104 parts In-Stock

1+ parts

$15.619

100+ parts

-

1k+ parts

$14.057

10k+ parts

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104

$15.619

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$14.057

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MKK Technologies

India . 255 parts In-Stock

1+ parts

$29.370

100+ parts

-

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255

$29.370

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DigiPath Technology Company

USA . 255 parts In-Stock

1+ parts

$29.370

100+ parts

-

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255

$29.370

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Corphita

USA . 1,356 parts In-Stock

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1,356

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Parana Technologies

USA . 1,220 parts In-Stock

1+ parts

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100+ parts

$18.675

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1,220

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$18.675

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Overview

Unlock superior performance with the L6918D from STMicroelectronics, a leader in innovative semiconductor solutions. This cutting-edge switching regulator excels in efficiency and reliability, making it ideal for demanding applications such as telecommunications, industrial controls, and power management systems. With its compact design and robust thermal capabilities, the L6918D delivers unparalleled value, empowering your designs to achieve peak performance while maintaining energy efficiency. Elevate your projects with a trusted partner in technology excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures long-lasting performance and reliability in various environments.

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and footprint, fitting well in standard designs.

No. of Terminals: 28

With 28 terminals, this device offers a comprehensive set of connections for flexible configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables high-density assemblies, ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

This high-temperature rating allows for operation in a broader range of environments, enhancing product usability.

Control Mode: CURRENT-MODE

Current-mode control allows for improved response times and stability under changing load conditions.

Minimum Operating Temperature: 0 °C

The product can operate in low-temperature environments, widening its application across various industries.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and compatibility with standard manufacturing processes.

Terminal Position: DUAL

Dual terminal positioning facilitates easy connections and enhances layout flexibility in circuit design.

Maximum Seated Height: 2.65 mm

A low seated height allows for low-profile designs, reducing overall product height in applications.

Width: 7.5 mm

Compact width contributes to saving space on PCBs, allowing for denser layout designs.

Other IC Type: SWITCHING CONTROLLER

Being a switching controller enhances efficiency in power regulation, making it suitable for a variety of applications.

Nominal Input Voltage: 12 V

A nominal input voltage of 12V suits a wide range of applications, providing compatibility with common power systems.

Length: 17.9 mm

A manageable length aids in fitting the component into various designs without complicating the layout.

Temperature Grade: COMMERCIAL

Designed for commercial use, this regulator is reliable across typical operating conditions in consumer products.

Maximum Switching Frequency: 1200 kHz

High switching frequency enables greater efficiency and smaller passive components, contributing to a compact overall design.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy surface mount soldering and ensure mechanical stability once mounted.

Control Technique: PULSE WIDTH MODULATION

PWM control technique enhances efficiency and delivers stable output voltage and current regulation.

Switcher Config: PHASE-SHIFT

Phase-shift configuration helps in minimizing electromagnetic interference (EMI), which is critical in sensitive applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies PCB layout and manufacturing processes, enhancing compatibility with existing designs.

Minimum Input Voltage: 5.8 V

The minimum input voltage of 5.8V allows for operation in environments where supply voltages may vary, offering versatility.

Technical Specifications

Switching Regulators & Controllers L6918D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

5.8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

1200 kHz

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L6918D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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