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L6917DTR

STMicroelectronics

L6917DTR by STMicroelectronics

L6917DTR by STMicroelectronics is a compact switching regulator designed for efficient power management. It features a nominal input voltage of 12V, a max switching frequency of 1MHz, and operates in current-mode control. Ideal for applications requiring precise voltage regulation in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,066

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-

-

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Anansix

USA . 1,072 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,072

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Vyrian

USA . 103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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103

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 559 parts In-Stock

1+ parts

$10.535

100+ parts

-

1k+ parts

$9.481

10k+ parts

-

559

$10.535

-

$9.481

-

MKK Technologies

India . 882 parts In-Stock

1+ parts

$19.810

100+ parts

-

1k+ parts

-

10k+ parts

-

882

$19.810

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DigiPath Technology Company

USA . 882 parts In-Stock

1+ parts

$19.810

100+ parts

-

1k+ parts

-

10k+ parts

-

882

$19.810

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-

-

Parana Technologies

USA . 1,730 parts In-Stock

1+ parts

-

100+ parts

$12.596

1k+ parts

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10k+ parts

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1,730

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$12.596

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Corphita

USA . 1,383 parts In-Stock

1+ parts

-

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1,383

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Overview

Elevate your designs with the L6917DTR from STMicroelectronics, a top-tier switching regulator that blends reliability and efficiency seamlessly. Renowned for its innovative solutions, STMicroelectronics delivers this compact powerhouse ideal for diverse applications, from telecommunications to industrial automation. Enjoy reduced energy consumption and enhanced performance, empowering your projects while ensuring quality and durability you can trust. Transform your circuitry today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures long-lasting performance and reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability enables easier integration into compact PCB designs, saving space and reducing assembly costs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, contributing to more compact designs.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for various input and output configurations, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint, making it ideal for space-constrained applications.

Control Mode: CURRENT-MODE

Current-mode control enhances system stability and response time, ensuring reliable operation in demanding applications.

Terminal Position: DUAL

Dual terminal position allows for flexible routing on the PCB, facilitating better layout options.

Maximum Seated Height: 2.65 mm

This low profile makes it suitable for slim designs where height restrictions are in place.

Width: 7.5 mm

The compact width contributes to easy integration into modern electronic devices and minimizes space usage on PCBs.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it offers efficient power conversion, making it suitable for a wide range of applications.

Nominal Input Voltage: 12 V

Optimized for a nominal input voltage of 12 V, this controller fits well in standard power supply designs.

Length: 17.9 mm

The length is tailored for compact applications, ensuring it can be used in tight spaces without compromising performance.

Maximum Switching Frequency: 1000 kHz

A high switching frequency allows for smaller passive components, contributing to a more compact design and improved efficiency.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of soldering during assembly.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation (PWM) allows for precise control of output voltage and current, enhancing overall efficiency.

Switcher Config: PHASE-SHIFT

Phase-shift switching improves efficiency in multi-channel designs, reducing noise and electromagnetic interference.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with standard PCB layouts, simplifying the design process.

Minimum Input Voltage: 8.5 V

Accommodating a minimum input voltage of 8.5 V allows for flexibility in various power supply designs.

Technical Specifications

Switching Regulators & Controllers L6917DTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

8.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

1000 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L6917DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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