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L6910GTR

STMicroelectronics

L6910GTR by STMicroelectronics

L6910GTR by STMicroelectronics is a compact switching regulator with a max input voltage of 12V and output current of 1.3A. It features a high switching frequency of 1MHz, utilizing PWM control for efficient power management. Ideal for space-constrained applications, it comes in a small outline package.

Median Price

$1.286

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6 parts In-Stock

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$1.286

6

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$1.286

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Vyrian

USA . 3,380 parts In-Stock

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3,380

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Digiode

USA . 2,035 parts In-Stock

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2,035

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Sensible Micro Corp

USA . 1,856 parts In-Stock

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1,856

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Anansix

USA . 576 parts In-Stock

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576

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Vigor

Singapore . 1,500 parts In-Stock

1+ parts

$2.730

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-

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1,500

$2.730

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Microchip USA

USA . 387 parts In-Stock

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$3.344

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387

$3.344

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

1+ parts

$8.004

100+ parts

-

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$7.204

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1,212

$8.004

-

$7.204

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MKK Technologies

India . 163 parts In-Stock

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$15.051

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163

$15.051

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DigiPath Technology Company

USA . 163 parts In-Stock

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$15.051

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$15.051

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Kepictronics

USA . 76,159 parts In-Stock

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76,159

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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2,250

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Perfect Parts

USA . 1,576 parts In-Stock

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1,576

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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Parana Technologies

USA . 1,185 parts In-Stock

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$9.570

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$9.570

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Corphita

USA . 504 parts In-Stock

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Overview

Unlock the potential of your designs with the L6910GTR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust switching regulator delivers impressive efficiency and reliability, ideal for a wide range of applications—from consumer electronics to industrial systems. With its compact size and advanced voltage control features, it ensures optimal performance while minimizing energy loss. Elevate your projects with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protects the internal components from environmental factors, enhancing the reliability of the switching regulator.

Surface Mount: YES

Being a surface mount device allows for compact PCB layouts, optimizing space and enabling higher density in electronic designs.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient space utilization on PCBs and facilitates easier integration into diverse applications.

No. of Terminals: 16

Having 16 terminals provides versatility in circuit connections, supporting complex designs while maintaining efficiency.

Package Style (Meter): SMALL OUTLINE

The small outline package enhances manufacturability and allows for high-density designs while conserving board space.

Control Mode: VOLTAGE-MODE

Voltage-mode control ensures stable output voltage regulation, making it suitable for applications requiring precise voltage levels.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and improves solderability, leading to more reliable connections.

Terminal Position: DUAL

Dual terminal positioning simplifies routing on a PCB, making it easier to design compact and effective circuits.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a slim profile, making it ideal for space-constrained applications where height is a concern.

Width: 3.9 mm

With a narrow width, this regulator can fit into tight spaces, providing flexibility in design and integration.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it effectively regulates power with higher efficiency compared to linear controllers, reducing energy losses.

Nominal Input Voltage: 12 V

A nominal input voltage of 12 V is common in many applications, making this product versatile and easy to implement in typical circuits.

Length: 9.9 mm

The compact length aids in fitting within tight design parameters, accommodating a variety of applications without compromising performance.

Maximum Switching Frequency: 1000 kHz

A high frequency of up to 1000 kHz allows for faster switching and reduces the size of external components like inductors and capacitors.

Maximum Output Current: 1.3 A

The ability to deliver up to 1.3 A makes this regulator suitable for powering demanding loads while maintaining performance.

Technology: BCDMOS

BCDMOS technology ensures high performance and efficiency, enabling the integration of high-voltage and low-voltage functions in a single chip.

Terminal Form: GULL WING

Gull wing terminals are favored for their ease of soldering, ensuring reliable connections in surface mount applications.

Control Technique: PULSE WIDTH MODULATION

PWM control technique allows for maintaining efficient energy conversion, resulting in reduced heat generation and increased reliability.

Switcher Config: PUSH-PULL

The push-pull configuration provides improved efficiency and reduced electromagnetic interference, making it suitable for noisy environments.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of handling and density, making it an excellent choice for various PCB layouts.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product is suitable for standard reflow soldering processes, ensuring ease of manufacturing and assembly.

Minimum Input Voltage: 5 V

The minimum input voltage of 5 V expands its application range, allowing it to work with lower voltage environments effectively.

Maximum Input Voltage: 12 V

A maximum input voltage of 12 V makes it compatible with a wide variety of operational systems commonly found in electronics.

Technical Specifications

Switching Regulators & Controllers L6910GTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

12 V

Minimum Input Voltage:

5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Output Current:

1.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1000 kHz

Technology:

BCDMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

L6910GTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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