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L6911CTR

STMicroelectronics

L6911CTR by STMicroelectronics

L6911CTR by STMicroelectronics is a voltage-mode switching regulator with a max input of 12V and output current of 1.3A. It features a compact SO package (7.5mm x 12.8mm) and operates at up to 1000kHz, ideal for efficient power management in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,697 parts In-Stock

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2,697

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Vyrian

USA . 1,415 parts In-Stock

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1,415

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Digiode

USA . 712 parts In-Stock

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712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 348 parts In-Stock

1+ parts

$13.532

100+ parts

-

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-

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-

348

$13.532

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

1+ parts

$19.873

100+ parts

-

1k+ parts

$17.886

10k+ parts

-

1,528

$19.873

-

$17.886

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MKK Technologies

India . 1,718 parts In-Stock

1+ parts

$37.370

100+ parts

-

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1,718

$37.370

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DigiPath Technology Company

USA . 1,718 parts In-Stock

1+ parts

$37.370

100+ parts

-

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1,718

$37.370

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A-Z Elektronik GmbH

Germany . 6,486 parts In-Stock

1+ parts

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6,486

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Alle Elektronik GmbH

Germany . 4,324 parts In-Stock

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4,324

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 3,244 parts In-Stock

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3,244

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Vigor

Singapore . 2,247 parts In-Stock

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2,247

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RC Electronics

USA . 744 parts In-Stock

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744

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Kepictronics

USA . 360 parts In-Stock

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360

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Parana Technologies

USA . 337 parts In-Stock

1+ parts

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$23.761

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337

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$23.761

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Overview

Elevate your designs with the L6911CTR from STMicroelectronics, a leader in innovative solutions. This high-performance switching regulator delivers exceptional reliability and efficiency, perfect for a wide range of applications, from consumer electronics to industrial systems. With its compact design and voltage-mode control, you can achieve optimal performance while saving valuable board space. Trust STMicroelectronics to empower your next project with quality that enhances functionality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and thermal performance, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier automation in PCB assembly, saving space and reducing assembly costs.

Package Shape: RECTANGULAR

The rectangular package shape is favorable for fitting into standard PCB layouts and optimizing board space.

No. of Terminals: 20

With 20 terminals, this component provides ample connectivity options for various applications while maintaining a manageable footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern electronics, enabling efficient use of board space and enhancing performance.

Control Mode: VOLTAGE-MODE

Voltage-mode control ensures stable operation under varying load conditions, making it reliable for sensitive applications.

Terminal Finish: TIN LEAD

Tin-lead terminals enhance solderability and ensure a strong, reliable electrical connection in various environmental conditions.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and simplified routing of electrical connections.

Maximum Seated Height: 2.65 mm

The low seated height contributes to the overall compactness of the design, making it suitable for space-constrained applications.

Width: 7.5 mm

A narrow width enables efficient use of space on printed circuit boards, facilitating modular designs.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it provides superior efficiency compared to linear regulators, reducing heat generation and power loss.

Nominal Input Voltage: 12 V

A nominal input voltage of 12V aligns well with common power sources, ensuring compatibility and ease of integration.

Length: 12.8 mm

The length is optimized for maximum performance in compact applications while facilitating practical PCB design.

Maximum Switching Frequency: 1000 kHz

A high maximum switching frequency allows for smaller output filters, improving efficiency and reducing overall size.

Maximum Output Current: 1.3 A

The ability to provide up to 1.3 A makes this regulator suitable for a variety of applications requiring moderate power levels.

Terminal Form: GULL WING

Gull wing terminals are advantageous for surface mount applications as they provide easy soldering and reliable mechanical strength.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation (PWM) allows for efficient control of output voltage and current, ensuring stable performance and enhancing efficiency.

Switcher Config: PUSH-PULL

The push-pull configuration is known for its efficiency and ability to drive higher currents, making it effective in various applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch facilitates easier placement and routing on PCBs, contributing to effective electronic designs.

Minimum Input Voltage: 5 V

Supporting a minimum input voltage of 5V broadens its application scope, accommodating a range of power sources.

Maximum Input Voltage: 12 V

The maximum input voltage of 12V allows flexibility in power supply choices while maintaining operational safety.

Technical Specifications

Switching Regulators & Controllers L6911CTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

12 V

Minimum Input Voltage:

5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

1.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1000 kHz

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L6911CTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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