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L6910G

STMicroelectronics

L6910G by STMicroelectronics

L6910G by STMicroelectronics is a compact switching regulator with a max output current of 1.3 A and operates at a nominal input voltage of 12 V. It features a high switching frequency of 1 MHz, utilizing PWM control for efficient power management. Ideal for applications requiring reliable voltage regulation in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,997 parts In-Stock

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6,997

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Anansix

USA . 669 parts In-Stock

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669

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Digiode

USA . 415 parts In-Stock

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415

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R&J Components

USA . 24 parts In-Stock

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24

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Microchip USA

USA . 216 parts In-Stock

1+ parts

$3.344

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216

$3.344

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IDEA Electronic Components Group

UK . 843 parts In-Stock

1+ parts

$10.799

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$9.719

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843

$10.799

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$9.719

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AZTECH Wire

Italy . 605 parts In-Stock

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$11.810

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605

$11.810

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MKK Technologies

India . 1,373 parts In-Stock

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$20.307

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1,373

$20.307

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DigiPath Technology Company

USA . 1,373 parts In-Stock

1+ parts

$20.307

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1,373

$20.307

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RC Electronics

USA . 7,470 parts In-Stock

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7,470

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A-Z Elektronik GmbH

Germany . 5,817 parts In-Stock

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5,817

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Alle Elektronik GmbH

Germany . 3,878 parts In-Stock

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3,878

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Vigor

Singapore . 1,925 parts In-Stock

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Parana Technologies

USA . 1,778 parts In-Stock

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$12.912

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1,778

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$12.912

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Corphita

USA . 398 parts In-Stock

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Kepictronics

USA . 310 parts In-Stock

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Overview

Elevate your designs with the L6910G from STMicroelectronics, a leader in innovative semiconductor solutions. This compact switching regulator offers exceptional efficiency and reliability, perfectly suited for everyday applications in consumer electronics and industrial systems alike. Experience seamless power management with advanced features that ensure optimal performance, providing you with unmatched value and peace of mind as you bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, ideal for modern electronic devices.

Package Shape: RECTANGULAR

A rectangular shape optimizes space on the PCB and improves layout flexibility in designs.

No. of Terminals: 16

With 16 terminals, the device can support multiple connections and functionalities, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE

Small outline packaging aids in achieving high-density circuit designs without compromising performance.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides stability and predictability in voltage regulation, ensuring reliable operation.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, increasing the longevity of connections.

Terminal Position: DUAL

Dual terminal position enhances ease of integration into PCB layouts and improves the product's adaptability.

Maximum Seated Height: 1.75 mm

A low profile of 1.75 mm helps in maintaining slim design profiles, which is crucial for portable devices.

Width: 3.9 mm

A narrow width allows for close placement of components, contributing to space efficiency and compact design.

Other IC type: SWITCHING CONTROLLER

As a switching controller, the product offers higher efficiency compared to linear regulators, leading to energy savings.

Nominal Input Voltage: 12 V

Designed for a nominal input voltage of 12 V, it is suitable for a wide range of applications in consumer electronics.

Length: 9.9 mm

The short length of 9.9 mm contributes to space-saving designs, making it easier to fit into compact electronic assemblies.

Maximum Switching Frequency: 1000 kHz

A high switching frequency of 1000 kHz enables faster response times and improved performance in high-efficiency applications.

Maximum Output Current: 1.3 A

With a maximum output current of 1.3 A, this controller can handle substantial loads, suitable for various power-hungry devices.

Technology: BCDMOS

BCDMOS technology enhances performance and reduces losses, making it ideal for power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, improving manufacturing efficiency.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation provides precise control over output voltage and current, leading to better power management.

Switcher Config: PUSH-PULL

A push-pull configuration enables balanced operation, enhancing the efficiency and reliability of the regulator.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for tight spacing of terminals, maximizing the use of board space.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate level of moisture sensitivity, making it suitable for standard manufacturing processes.

Minimum Input Voltage: 5 V

Low minimum input voltage of 5 V expands the range of applications and increases compatibility with various systems.

Maximum Input Voltage: 12 V

The maximum input voltage limit of 12 V offers flexibility in application while preventing damage and ensuring safe operation.

Technical Specifications

Switching Regulators & Controllers L6910G attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

12 V

Minimum Input Voltage:

5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Output Current:

1.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1000 kHz

Technology:

BCDMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

L6910G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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