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L6917BDTR

STMicroelectronics

L6917BDTR by STMicroelectronics

L6917BDTR by STMicroelectronics is a compact switching regulator with a max operating temp of 70 °C and supports input voltages from 8.5V to 12V. It features a high switching frequency of 600 kHz and operates in current-mode control. Ideal for efficient power management in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 15,000 parts In-Stock

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15,000

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R&J Components

USA . 5,000 parts In-Stock

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5,000

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 4,904 parts In-Stock

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4,904

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Anansix

USA . 2,437 parts In-Stock

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2,437

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Digiode

USA . 454 parts In-Stock

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454

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IDEA Electronic Components Group

UK . 1,512 parts In-Stock

1+ parts

$13.075

100+ parts

-

1k+ parts

$11.768

10k+ parts

-

1,512

$13.075

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$11.768

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Microchip USA

USA . 308 parts In-Stock

1+ parts

$14.233

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-

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308

$14.233

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MKK Technologies

India . 2,378 parts In-Stock

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$24.587

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2,378

$24.587

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DigiPath Technology Company

USA . 2,378 parts In-Stock

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$24.587

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2,378

$24.587

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Component Stockers USA

USA . 458 parts In-Stock

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$99.990

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458

$99.990

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Kepictronics

USA . 26,434 parts In-Stock

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Perfect Parts

USA . 19,040 parts In-Stock

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Vigor

Singapore . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,572 parts In-Stock

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4,572

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Alle Elektronik GmbH

Germany . 3,048 parts In-Stock

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Corphita

USA . 2,606 parts In-Stock

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2,606

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 719 parts In-Stock

1+ parts

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$15.633

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719

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$15.633

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Overview

Elevate your designs with the L6917BDTR from STMicroelectronics—a pinnacle of reliability in switching regulators! Crafted for efficiency, this compact powerhouse ensures optimal performance in demanding applications. With a robust temperature range and advanced control capabilities, it stands out for its seamless integration and exceptional adaptability. Trust in STMicroelectronics' legacy of quality to power your innovations. Experience unparalleled value and precision with every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental challenges, enhancing product longevity.

Surface Mount: YES

Being surface mount compatible allows for efficient space-saving designs and easier integrations into modern PCBs.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact footprint, making it ideal for high-density applications.

No. of Terminals: 28

With 28 terminals, the product provides ample connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates ease of placement on PCBs and promotes space efficiency.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows for good thermal performance, suitable for a variety of applications.

Control Mode: CURRENT-MODE

Current-mode control provides improved transient response and increased stability in power regulation, enhancing overall performance.

Minimum Operating Temperature: 0 °C

Operational from 0 °C, this regulator can effectively function in a wide range of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and corrosion resistance, promoting reliable connections.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible layout designs, supporting various PCB configurations.

Maximum Seated Height: 2.65 mm

A low maximum seated height is advantageous for low-profile applications, maintaining overall compactness in designs.

Width: 7.5 mm

A width of 7.5 mm helps in fitting this component into tighter spaces, accommodating modern design requirements.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it provides efficient power conversion, making it suitable for a range of applications.

Nominal Input Voltage: 12 V

A nominal input voltage of 12 V aligns with standard power supply systems, simplifying integration into existing setups.

Length: 17.9 mm

The compact length of 17.9 mm supports space-constrained applications while retaining functionality.

Temperature Grade: COMMERCIAL

Rated as commercial grade, this regulator meets a wide range of application needs, covering various operating conditions.

Maximum Switching Frequency: 600 kHz

A maximum switching frequency of 600 kHz allows for efficient energy transfer and reduces the size of passive components.

Technology: BCDMOS

Utilizing BCDMOS technology enables higher integration and improved performance characteristics in power management.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering and mechanical stability, ensuring reliable connections during operation.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control results in efficient switching and improved regulation, crucial for maintaining output stability.

Switcher Config: PHASE-SHIFT

Phase-shift switching configuration enhances the efficiency of power delivery in multi-phase designs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is compatible with various PCB layouts, facilitating broader application use.

Minimum Input Voltage: 8.5 V

The minimum input voltage of 8.5 V enhances flexibility in design, accommodating various supply sources.

Technical Specifications

Switching Regulators & Controllers L6917BDTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

8.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

600 kHz

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L6917BDTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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