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L6452DIE8

STMicroelectronics

L6452DIE8 by STMicroelectronics

L6452DIE8 by STMicroelectronics is a versatile addressable latch-based peripheral driver, operating b/w 4.5V and 5.5V with a max temp of 70 °C. It features built-in transient and thermal protections, ensuring reliable performance. Ideal for applications requiring precise control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,640 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,640

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-

-

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Anansix

USA . 2,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,006

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Vyrian

USA . 533 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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533

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$10.002

100+ parts

-

1k+ parts

$9.002

10k+ parts

-

1,353

$10.002

-

$9.002

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MKK Technologies

India . 1,316 parts In-Stock

1+ parts

$18.809

100+ parts

-

1k+ parts

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10k+ parts

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1,316

$18.809

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DigiPath Technology Company

USA . 1,316 parts In-Stock

1+ parts

$18.809

100+ parts

-

1k+ parts

-

10k+ parts

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1,316

$18.809

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-

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Parana Technologies

USA . 2,272 parts In-Stock

1+ parts

-

100+ parts

$11.959

1k+ parts

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2,272

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$11.959

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Corphita

USA . 1,877 parts In-Stock

1+ parts

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100+ parts

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1,877

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Overview

Elevate your designs with the L6452DIE8 from STMicroelectronics, a leading name in innovative semiconductor solutions. This powerful peripheral driver seamlessly enhances performance while ensuring robust thermal and transient protection. With its dependable operation across various applications, from automation to consumer electronics, the L6452DIE8 delivers unparalleled efficiency and reliability—perfect for engineers seeking quality and peace of mind in every project.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for a compact design and easier integration into modern printed circuit boards, saving space and improving performance.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various applications, ensuring compatibility with a wide range of systems and components.

No. of Functions: 2

Having two functions enhances versatility, allowing the device to handle multiple tasks or operations within a single component, which simplifies circuit design.

Built-in Protections: TRANSIENT; THERMAL

The inclusion of transient and thermal protections increases reliability and longevity of the device by safeguarding it against voltage spikes and overheating.

Package Style (Meter): UNCASED CHIP

The unencased chip design allows for custom packaging solutions, giving engineers the flexibility to implement the driver in various thermal and mechanical configurations.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage requirement maximizes compatibility with battery-powered and low-voltage applications, enhancing its usability in diverse scenarios.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can function reliably in extended environments, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures the device can operate effectively in slightly cold environments, broadening its operational range.

Terminal Position: UPPER

The upper terminal position allows easier access and connections, facilitating simpler assembly and integration within a variety of mounting scenarios.

Temperature Grade: COMMERCIAL

Rated for commercial temperature applications, this product meets a wide range of industry standards, ensuring reliability in non-harsh environments.

Terminal Form: NO LEAD

No-lead terminals provide a smaller footprint and lower profile, which is advantageous for miniaturized electronic designs and enhances soldering reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with common power standards, ensuring compatibility with a vast array of systems and components.

Turn-on Time: 0.325 us

A fast turn-on time of 0.325 microseconds contributes to quicker response rates in applications, making it suitable for high-speed digital environments.

Interface IC Type: ADDRESSABLE LATCH BASED PERIPHERAL DRIVER

The addressable latch-based interface allows precise control of multiple outputs, making the product ideal for sophisticated peripheral control systems in complex applications.

Turn-off Time: 0.325 us

Similarly, the fast turn-off time ensures swift cessation of current flow, which is critical for minimizing power consumption and artifacts in digital circuits.

Output Current Flow Direction: SOURCE

With the output current flow direction set as source, this device can effectively control connected loads, enhancing its range of applications in electronic designs.

Technical Specifications

Peripheral Drivers L6452DIE8 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES ANALOG SUPPLY 10.5 TO 12.5 VOLTS

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

X-XUUC-N

No. of Functions:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.325 us

Turn-on Time:

.325 us

Trade Compliance

L6452DIE8 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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