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L6450FN

STMicroelectronics

L6450FN by STMicroelectronics

L6450FN by STMicroelectronics is a BICMOS peripheral driver with a nominal voltage of 5V and supports up to 2A output peak current. It features built-in transient protection and operates within a temperature range of 0 °C to 70°C. Ideal for surface mount applications, it comes in a compact square package with 44 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,227 parts In-Stock

1+ parts

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4,227

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Vyrian

USA . 1,716 parts In-Stock

1+ parts

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1,716

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Anansix

USA . 691 parts In-Stock

1+ parts

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691

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 639 parts In-Stock

1+ parts

$1.892

100+ parts

-

1k+ parts

$1.702

10k+ parts

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639

$1.892

-

$1.702

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MKK Technologies

India . 978 parts In-Stock

1+ parts

$3.557

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978

$3.557

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DigiPath Technology Company

USA . 978 parts In-Stock

1+ parts

$3.557

100+ parts

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978

$3.557

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Parana Technologies

USA . 1,568 parts In-Stock

1+ parts

-

100+ parts

$2.262

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1,568

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$2.262

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Corphita

USA . 1,271 parts In-Stock

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1,271

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Overview

Unlock unparalleled performance with the L6450FN from STMicroelectronics, a trusted leader in innovation and quality. This cutting-edge peripheral driver excels in demanding applications, providing robust built-in protections and efficient operation within a wide voltage range. Its compact design and reliable thermal performance make it ideal for various uses, ensuring your projects benefit from superior reliability and lasting value. Elevate your designs with the expertise of STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface-mount capability allows for easier integration into compact electronic designs, improving space efficiency.

Maximum Supply Voltage: 5.25 V

Supports a higher voltage range, providing flexibility in design and compatibility with a variety of systems.

Package Shape: SQUARE

The square package shape aids in uniform thermal performance and can be optimized for PCB layouts.

Built-in Protections: TRANSIENT

Built-in transient protection enhances device reliability by safeguarding against voltage spikes.

No. of Terminals: 44

A significant number of terminals allows for complex circuit designs and robust functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier style is ideal for high-density, high-performance applications, facilitating effective thermal management.

Minimum Supply Voltage: 4.75 V

A low minimum supply voltage makes the product compatible with low-power applications, enhancing versatility.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature is crucial for applications in higher temperature environments, ensuring stability.

Minimum Operating Temperature: 0 °C

Operational range starting at 0 °C allows it to be deployed in various environments without performance issues.

Terminal Position: QUAD

Quad terminal position facilitates better routing on PCBs and enhances performance in multi-channel applications.

Maximum Seated Height: 4.57 mm

A low seated height is beneficial for low-profile designs, supporting space-constrained applications.

Width: 16.5862 mm

Standard width makes it easy to incorporate into existing designs and layouts without requiring extensive modifications.

Length: 16.5862 mm

Consistent length complements the width for a compact, space-efficient design ideal for various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures suitability for consumer electronics and general usage, providing cost efficiency.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS, offering high speed and low power consumption, making it ideal for efficient designs.

Terminal Form: J BEND

J bend terminals support secure mounting on PCBs, improving assembly reliability during manufacturing.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage simplifies integration with common digital circuits, facilitating ease of use.

Terminal Pitch: 1.27 mm

A common terminal pitch provides compatibility with a wide range of circuit board designs and components.

Nominal Output Peak Current Limit: 2 A

A 2 A output peak current limit makes this product suitable for driving peripheral devices, enhancing its versatility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed specifically as a buffer or inverter, this IC type is essential for ensuring signal integrity in peripheral applications.

Technical Specifications

Peripheral Drivers L6450FN attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Peak Current Limit:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

L6450FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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