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L6451013TR

STMicroelectronics

L6451013TR by STMicroelectronics

L6451013TR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 38V and supports up to 2A output current. It features built-in transient protection and operates in temperatures from 0 °C to 70°C. Ideal for buffer or inverter applications, it comes in a compact chip carrier package.

Median Price

$7.504

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 20 parts In-Stock

1+ parts

$7.504

100+ parts

$3.752

1k+ parts

-

10k+ parts

-

20

$7.504

$3.752

-

-

Vyrian

USA . 12,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,253

-

-

-

-

Digiode

USA . 3,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,455

-

-

-

-

Anansix

USA . 2,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,621

-

-

-

-

Microfarads

USA . 1,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,224

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 448 parts In-Stock

1+ parts

$6.782

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$6.782

-

-

-

IDEA Electronic Components Group

UK . 1,298 parts In-Stock

1+ parts

$8.846

100+ parts

-

1k+ parts

$7.961

10k+ parts

-

1,298

$8.846

-

$7.961

-

MKK Technologies

India . 215 parts In-Stock

1+ parts

$16.634

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$16.634

-

-

-

DigiPath Technology Company

USA . 215 parts In-Stock

1+ parts

$16.634

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$16.634

-

-

-

AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$20.460

100+ parts

-

1k+ parts

-

10k+ parts

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729

$20.460

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Corphita

USA . 1,510 parts In-Stock

1+ parts

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1,510

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Parana Technologies

USA . 1,269 parts In-Stock

1+ parts

-

100+ parts

$10.576

1k+ parts

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10k+ parts

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1,269

-

$10.576

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iodParts Technologies Inc.

India . 500 parts In-Stock

1+ parts

-

100+ parts

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500

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-

-

Overview

Elevate your designs with the L6451013TR from STMicroelectronics, a trusted leader in innovative solutions. This advanced peripheral driver guarantees exceptional performance and reliability, ensuring your applications run smoothly in diverse environments. With built-in protections against transients and robust temperature resilience, it offers unmatched value for industrial automation, robotics, and consumer electronics. Choose the L6451013TR to unlock efficiency and enhance your product's capabilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for a compact design, making integration into devices easier and saving space.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows this peripheral driver to work effectively with various power supply configurations.

Package Shape: SQUARE

The square shape facilitates efficient placement on PCBs and optimizes space utilization.

Built-in Protections: TRANSIENT

Transient protection enhances the product’s reliability by safeguarding against voltage spikes and surges.

Maximum Supply Voltage-1: 38 V

This wide range allows for versatile applications in different systems requiring higher voltage levels.

No. of Terminals: 44

A higher number of terminals facilitates more connections and makes the driver suitable for complex systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style enables easier handling and assembly for manufacturers.

Minimum Supply Voltage-1: 9 V

Allows for adaptable use in systems that operate with higher minimum voltage requirements.

Minimum Supply Voltage: 4.75 V

This specification ensures compatibility with various low-voltage applications, making it versatile.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the product to function reliably in hot environments.

Minimum Operating Temperature: 0 °C

It can operate in standard environmental conditions without performance degradation, making it robust.

Terminal Finish: TIN LEAD

The tin-lead finish offers excellent solderability, ensuring strong electrical connections.

Terminal Position: QUAD

Quad positioning of terminals allows for efficient wiring and connection in compact spaces.

Maximum Seated Height: 4.57 mm

The low profile design supports integration in space-constrained applications.

Width: 16.5862 mm

The compact width makes this driver suitable for various electronic applications, especially where space is limited.

Length: 16.5862 mm

The equal length to width ratio can help create uniform designs in PCB layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates that it is suitable for general-use applications with reasonable performance expectations.

Technology: BCD

BCD technology enhances performance and efficiency, making it a modern choice for electronic devices.

Terminal Form: J BEND

The J bend terminal design facilitates easier soldering and reliable connections.

Nominal Supply Voltage: 5 V

Working with a standard nominal supply voltage makes this product compatible with most electronic devices.

Terminal Pitch: 1.27 mm

This terminal pitch allows for high-density circuit designs, valuable in modern electronics.

Nominal Supply Voltage-1: 18 V

Support for different nominal voltages enhances flexibility for various applications.

Nominal Output Peak Current Limit: 2 A

A peak current limit of 2 A allows this driver to efficiently control larger loads without damage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The specific interface type indicates a versatile application in buffering or inverting signals, ideal for peripheral operations.

Output Current Flow Direction: SINK

The sink current flow direction enables effective control of devices that require sinking outputs, enhancing its usability in various applications.

Technical Specifications

Peripheral Drivers L6451013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

38 V

Minimum Supply Voltage-1:

9 V

Nominal Supply Voltage-1:

18 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

L6451013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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