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L6451FN

STMicroelectronics

L6451FN by STMicroelectronics

L6451FN by STMicroelectronics is a BICMOS peripheral driver with a nominal voltage of 5V and operates within a temperature range of 0 °C to 70°C. It features built-in transient protection and comes in a compact square chip carrier package. Ideal for buffering or inverting applications, it supports surface mount technology with 44 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,131

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-

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Vyrian

USA . 1,483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,483

-

-

-

-

Anansix

USA . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,253

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 897 parts In-Stock

1+ parts

$3.543

100+ parts

-

1k+ parts

$3.189

10k+ parts

-

897

$3.543

-

$3.189

-

MKK Technologies

India . 454 parts In-Stock

1+ parts

$6.662

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$6.662

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-

-

DigiPath Technology Company

USA . 454 parts In-Stock

1+ parts

$6.662

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$6.662

-

-

-

Corphita

USA . 3,683 parts In-Stock

1+ parts

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3,683

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Parana Technologies

USA . 387 parts In-Stock

1+ parts

-

100+ parts

$4.236

1k+ parts

-

10k+ parts

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387

-

$4.236

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Overview

Unlock seamless performance with the L6451FN from STMicroelectronics, a trusted leader in innovative electronic solutions. This advanced peripheral driver is designed for a diverse range of applications, delivering unparalleled reliability and efficiency. Benefit from superior transient protection and commercial-grade quality, ensuring your projects run smoothly under varying conditions. Experience enhanced durability and functionality that empowers your designs to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and longevity, making this peripheral driver suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space, enabling compact designs and streamlined manufacturing processes.

Maximum Supply Voltage: 5.25 V

The maximum supply voltage provides flexibility for integration into systems with varying voltage requirements and ensures compatibility with standard power supplies.

Package Shape: SQUARE

The square package shape allows for effective thermal management and easy alignment during assembly, improving the overall performance of the device.

Built-in Protections: TRANSIENT

Built-in transient protections safeguard the device against voltage spikes and electrical interference, enhancing reliability in sensitive applications.

No. of Terminals: 44

A higher number of terminals enhances the versatility and connectivity options for larger systems, accommodating various peripheral devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style facilitates easy handling and mounting, making it a practical choice for high-density PCBs.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage ensures stable operation in a wide range of environments, ensuring that the device remains functional in lower-power scenarios.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows the product to perform effectively in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can be utilized in various climate conditions, expanding its application range.

Terminal Position: QUAD

The quad terminal position enhances routing flexibility on the PCB, simplifying layout design and improving manufacturability.

Maximum Seated Height: 4.57 mm

The compact seated height facilitates integration into space-constrained designs, ideal for modern electronic devices with limited space.

Width: 16.5862 mm

The precise width ensures compatibility with standard mounting options for diverse applications, aiding in ease of installation.

Length: 16.5862 mm

The consistent length aligns with industry standards, making it easy to fit into existing designs without extensive modifications.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, the device is suitable for general consumer electronics, offering reliability in everyday applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS, providing high-speed operation and low power consumption, making it an efficient choice.

Terminal Form: J BEND

The J bend terminal form ensures secure connections and simplifies the soldering process, enhancing the overall assembly reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with common electronic systems, ensuring compatibility and ease of integration into various applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch facilitates easier manual soldering and machine assembly, providing flexibility for manufacturing processes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter based peripheral driver, it enhances signal integrity and boosts performance, ensuring reliable communication with other components.

Technical Specifications

Peripheral Drivers L6451FN attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

L6451FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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