Loading...

L3G4IS

STMicroelectronics

L3G4IS by STMicroelectronics

L3G4IS by STMicroelectronics is a 16-terminal chip carrier with power supplies of 2.8V and 3.3V, suitable for surface mount applications. With a temperature range from -30 °C to 85°C, it is ideal for various functions in electronic devices requiring precise motion sensing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,155

-

-

-

-

Anansix

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,380

-

-

-

-

Vyrian

USA . 114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

114

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,254 parts In-Stock

1+ parts

$22.023

100+ parts

-

1k+ parts

$19.821

10k+ parts

-

2,254

$22.023

-

$19.821

-

MKK Technologies

India . 812 parts In-Stock

1+ parts

$41.413

100+ parts

-

1k+ parts

-

10k+ parts

-

812

$41.413

-

-

-

DigiPath Technology Company

USA . 812 parts In-Stock

1+ parts

$41.413

100+ parts

-

1k+ parts

-

10k+ parts

-

812

$41.413

-

-

-

Corphita

USA . 1,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,852

-

-

-

-

Parana Technologies

USA . 1,463 parts In-Stock

1+ parts

-

100+ parts

$26.332

1k+ parts

-

10k+ parts

-

1,463

-

$26.332

-

-

Overview

Upgrade your devices with the advanced L3G4IS by STMicroelectronics. With a reputation for excellence in semiconductor manufacturing, STMicroelectronics delivers top-quality products that exceed industry standards. The L3G4IS is versatile and can be used in a variety of applications. Experience improved performance and reliability with this innovative product. Choose STMicroelectronics for cutting-edge technology that enhances your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the semiconductor components inside, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Being surface mountable makes this product suitable for compact and space-constrained designs, allowing for easy integration into electronic devices.

Package Shape: SQUARE

The square package shape offers a symmetrical design that can facilitate consistent and uniform placement on circuit boards, optimizing electrical connections and signal integrity.

Power Supplies (V): 2.8,3.3

The availability of multiple power supply options at 2.8V and 3.3V enhances flexibility for different voltage requirements in various electronic applications, ensuring compatibility and efficiency.

No. of Terminals: 16

With 16 terminals, this product offers a sufficient number of connections for interfacing with other components or devices, enabling more complex circuit configurations and functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and robust housing for the semiconductor chip, offering protection against environmental factors and mechanical stress, ensuring longevity and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows this product to withstand elevated temperatures during operation, making it suitable for industrial and automotive applications where heat management is critical.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures proper functionality of the product even in cold environments, expanding its usability in a wide range of operating conditions.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection interface, reducing the risk of signal interference or disconnection, enhancing the overall reliability and performance of the product.

Terminal Form: NO LEAD

The absence of leads in the terminal form eliminates the risk of solder joint failures or short circuits, improving the overall quality and longevity of the product.

Terminal Pitch: 0.635 mm

The fine terminal pitch of 0.635 mm enables high-density mounting on circuit boards, allowing for more miniaturized designs and efficient use of PCB space, making it ideal for compact electronic devices.

Technical Specifications

Other Function Semiconductors L3G4IS attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-N16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

L3G4IS Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7