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L3G4200DHTR

STMicroelectronics

L3G4200DHTR by STMicroelectronics

L3G4200DHTR by STMicroelectronics is a compact, industrial-grade 3-axis gyroscope with a supply voltage range of 2.4V to 3.6V. It features a max operating temp of 85 °C and comes in a square grid array package. Ideal for motion sensing applications in consumer electronics and robotics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,092 parts In-Stock

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3,092

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Vyrian

USA . 2,508 parts In-Stock

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2,508

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Anansix

USA . 2,294 parts In-Stock

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2,294

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J2 Sourcing AB

Sweden . 949 parts In-Stock

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949

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,761 parts In-Stock

1+ parts

$20.716

100+ parts

-

1k+ parts

$18.644

10k+ parts

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1,761

$20.716

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$18.644

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MKK Technologies

India . 1,041 parts In-Stock

1+ parts

$38.954

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1,041

$38.954

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DigiPath Technology Company

USA . 1,041 parts In-Stock

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$38.954

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1,041

$38.954

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Corphita

USA . 2,219 parts In-Stock

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2,219

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Parana Technologies

USA . 2,123 parts In-Stock

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$24.769

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2,123

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$24.769

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Overview

Unlock the potential of your projects with the L3G4200DHTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact and robust chip excels in diverse applications, from motion sensing to industrial automation, delivering unmatched performance in extreme temperatures. Its reliable design and innovative technology ensure longevity and efficiency, providing customers with exceptional value and peace of mind. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller overall footprint and enables automated assembly, improving manufacturing efficiency.

Package Shape: SQUARE

The square shape optimizes board space utilization and simplifies layout design for compact electronic devices.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3 V balances performance and energy efficiency, suitable for battery-operated applications.

Power Supplies (V): 3

This specification confirms compatibility with standard power supply values, making integration into existing systems straightforward.

No. of Terminals: 16

With 16 terminals, the product offers ample connectivity options for more complex functionalities while maintaining a compact design.

Package Style (Meter): GRID ARRAY

The grid array style improves thermal performance and reliability, particularly in high-density applications.

Maximum Operating Temperature: 85 °C

An operating temperature range up to 85 °C allows the product to be used in industrial environments without risk of failure.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C ensures functionality in extreme cold, making it ideal for outdoor and rugged applications.

Terminal Finish: NICKEL GOLD

Nickel gold terminal finish enhances corrosion resistance and ensures reliable connections over time, beneficial for long-term use.

Terminal Position: BOTTOM

Bottom terminal positioning improves heat dissipation and allows for better thermal management in compact designs.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a low-profile design, ideal for space-constrained applications.

Width: 4 mm

The compact width of 4 mm is suitable for modern miniaturized devices, aiding in the design of sleek products.

Other IC type: ANALOG CIRCUIT

As an analog circuit, this IC offers continuous signal processing capabilities, essential for audio and sensor applications.

Minimum Supply Voltage (Vsup): 2.4 V

A minimum supply voltage of 2.4 V allows for flexibility in power sourcing, accommodating a range of battery technologies.

Maximum Time At Peak Reflow Temperature: 30 s

With a maximum reflow time of 30 seconds, this IC is compatible with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature: 260 C

Operating at a peak reflow temperature of 260 °C ensures compatibility with lead-free soldering processes, aligning with industry standards.

Length: 4 mm

Measuring just 4 mm in length, it maintains a compact profile, facilitating integration into space-constrained electronic configurations.

Temperature Grade: INDUSTRIAL

Rated for industrial-grade applications, this product guarantees reliability and performance in demanding environments.

Technology: CMOS

CMOS technology enhances power efficiency, making it suitable for battery-powered and portable devices.

Terminal Form: BUTT

Butt terminal form aids in robust mechanical connections, improving the reliability of installations.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density packaging, ideal for modern applications requiring compact designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product requires moderate precautions in handling, ensuring longevity and reliability.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides a safe operating range for various applications, enhancing design flexibility.

Technical Specifications

Other Function Semiconductors L3G4200DHTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

L3G4200DHTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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