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L3G4200DH

STMicroelectronics

L3G4200DH by STMicroelectronics

STMicroelectronics L3G4200DH is a 16-terminal sensor with 3V supply voltage, operating from -40 to 85°C. It's a CMOS analog circuit in a square plastic package for industrial applications requiring precise motion sensing and orientation tracking.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,438 parts In-Stock

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2,438

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Digiode

USA . 2,144 parts In-Stock

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2,144

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Vyrian

USA . 666 parts In-Stock

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666

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Semicontronic

India . 1,501 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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-

1,501

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 506 parts In-Stock

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$7.500

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506

$7.500

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AZTECH Wire

Italy . 773 parts In-Stock

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$11.665

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773

$11.665

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Corohmni

South Africa . 965 parts In-Stock

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$18.028

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965

$18.028

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IDEA Electronic Components Group

UK . 10 parts In-Stock

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$20.556

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$18.501

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10

$20.556

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$18.501

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Aztec Data Supply Inc.

USA . 3,435 parts In-Stock

1+ parts

$22.910

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3,435

$22.910

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MKK Technologies

India . 59 parts In-Stock

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$38.655

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59

$38.655

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DigiPath Technology Company

USA . 59 parts In-Stock

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$38.655

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59

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Argo Parts USA

USA . 3,657 parts In-Stock

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Corphita

USA . 2,956 parts In-Stock

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Parana Technologies

USA . 1,970 parts In-Stock

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$24.578

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$24.578

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Continental Prestige Electronics

USA . 1,929 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Overview

Unlock the potential of your next project with the L3G4200DH by STMicroelectronics. Crafted with precision and reliability in mind, this sensor offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, the L3G4200DH delivers exceptional value and accuracy, setting you up for success every step of the way. Trust in STMicroelectronics' reputation for quality and innovation, and experience the difference in your designs with the L3G4200DH.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it a reliable choice for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape offers a compact design, ideal for space-saving requirements in electronic devices.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage ensures compatibility with a wide range of systems, offering versatility in usage.

Power Supplies (V): 3

With 3 power supplies, this semiconductor can support multiple functions or components within a system.

No. of Terminals: 16

The 16 terminals provide connectivity options for various connections, enhancing flexibility in circuit integration.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and excellent electrical performance.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this semiconductor can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable performance in both extreme cold and hot conditions.

Terminal Finish: NICKEL GOLD

The nickel gold finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for soldering and rework, simplifying assembly processes.

Maximum Seated Height: 1.1 mm

The low profile design saves space and allows for compact integration into electronic devices.

Width (mm): 4 mm

The 4mm width offers a small footprint, ideal for applications with limited space availability.

Other IC type: ANALOG CIRCUIT

Analog circuit type provides precise and accurate signal processing, making it suitable for sensors and measurement applications.

Minimum Supply Voltage (Vsup): 2.4 V

The 2.4V minimum supply voltage ensures compatibility with low-power systems, saving energy.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during assembly processes, ensuring proper connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures durability and reliability during manufacturing processes.

Length: 4 mm

The 4mm length offers a compact design, suitable for applications with limited board space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in challenging environments.

Technology: CMOS

CMOS technology provides low power consumption and fast switching speeds, ideal for battery-operated devices.

Terminal Form: BUTT

Butt terminal form offers secure connections, enhancing reliability and stability in circuit connections.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, ensuring proper handling and storage procedures.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage provides a safe operating range, protecting the semiconductor from overvoltage.

Technical Specifications

Other Function Semiconductors L3G4200DH attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

L3G4200DH Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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