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L3G4200DTR

STMicroelectronics

L3G4200DTR by STMicroelectronics

L3G4200DTR by STMicroelectronics is a 16-terminal, 3V gyro sensor with a temperature range of -40 to 85°C. It features a thin profile and fine pitch grid array package, suitable for industrial applications requiring precise motion sensing in compact spaces.

Median Price

$21.527

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

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Freelance Electronics

USA . 5 parts In-Stock

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$21.527

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$25.832

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$21.312

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$21.527

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Vyrian

USA . 5,141 parts In-Stock

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Chip Stock

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Digiode

USA . 3,602 parts In-Stock

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Anansix

USA . 2,554 parts In-Stock

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Avant Electronics Limited

UK . 245 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Sea View Technologies

USA . 120 parts In-Stock

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SPM Sales

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J2 Sourcing AB

Sweden . 30 parts In-Stock

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Prism Electronics

USA . 4 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 585 parts In-Stock

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$5.500

100+ parts

$5.362

1k+ parts

$5.335

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585

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 917 parts In-Stock

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$6.500

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917

$6.500

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AZTECH Wire

Italy . 420 parts In-Stock

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$9.144

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420

$9.144

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Corohmni

South Africa . 275 parts In-Stock

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$9.753

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$9.753

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Aztec Data Supply Inc.

USA . 181 parts In-Stock

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$10.050

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IDEA Electronic Components Group

UK . 237 parts In-Stock

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$10.873

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$9.786

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MKK Technologies

India . 1,711 parts In-Stock

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$20.447

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DigiPath Technology Company

USA . 1,711 parts In-Stock

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$20.447

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S.R.D Solutions

India . 96,000 parts In-Stock

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RC Electronics

USA . 36,242 parts In-Stock

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Perfect Parts

USA . 10,680 parts In-Stock

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Lixinc

USA . 9,760 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,884 parts In-Stock

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Corphita

USA . 3,326 parts In-Stock

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Argo Parts USA

USA . 2,103 parts In-Stock

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Continental Prestige Electronics

USA . 1,280 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,099 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 218 parts In-Stock

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ChipstoGo Electronic ltd

UK . 7 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the STMicroelectronics L3G4200DTR, a high-quality sensor designed to enhance performance and accuracy. With a reputable manufacturer like STMicroelectronics behind it, you can trust in the reliability and innovation of this product. Ideal for a wide range of applications, this sensor offers unparalleled value by providing precise measurements and reliable data. Take your projects to the next level with the L3G4200DTR and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the product, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board and can facilitate easier routing of traces.

Nominal Supply Voltage (Vsup): 3 V

Optimal nominal supply voltage of 3V ensures proper functionality and performance of the semiconductor device.

No. of Terminals: 16

Having 16 terminals provides flexibility in connections and allows for a wide range of applications for the semiconductor product.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers high density integration and efficient signal routing capability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliability and stability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows the semiconductor to operate in extreme cold conditions without performance issues.

Terminal Finish: NICKEL GOLD

Nickel gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the placement of the semiconductor on the circuit board and facilitates easy soldering.

Maximum Seated Height: 1.1 mm

Low maximum seated height of 1.1mm enables the semiconductor to be used in applications where space is limited.

Width (mm): 4 mm

Compact width of 4mm allows for efficient use of space on the circuit board.

Other IC type: ANALOG CIRCUIT

Analog circuit type provides precise signal processing and accuracy, making the semiconductor suitable for applications requiring analog functionality.

Minimum Supply Voltage (Vsup): 2.4 V

Low minimum supply voltage of 2.4V allows for flexible power input options and energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Long maximum time at peak reflow temperature of 30 seconds allows for proper soldering and rework processes during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust solder joints and reliable connections.

Length: 4 mm

Compact length of 4mm enables the semiconductor to be used in space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the semiconductor can withstand harsh operating conditions commonly found in industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the semiconductor.

Terminal Form: BUTT

Butt terminal form simplifies the soldering process and ensures strong mechanical connections on the circuit board.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high density packaging and precise connection to other components.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the semiconductor is suitable for surface mounting and reflow soldering with a peak temperature of 260°C.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage of 3.6V provides flexibility in power input options and ensures compatibility with a wide range of applications.

Technical Specifications

Other Function Semiconductors L3G4200DTR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

BUTT

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

L3G4200DTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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