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HCF4538M013TR

STMicroelectronics

HCF4538M013TR by STMicroelectronics

HCF4538M013TR by STMicroelectronics is a CMOS prescaler with dual functions, operating at 5V and featuring a propagation delay of 600 ns. It supports temperatures from -55 °C to 125 °C, making it ideal for military applications. This compact SOIC package ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 63,750 parts In-Stock

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63,750

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ComSIT USA

USA . 63,750 parts In-Stock

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63,750

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Martec Srl

Italy . 6,000 parts In-Stock

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6,000

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Vyrian

USA . 4,637 parts In-Stock

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4,637

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Digiode

USA . 3,414 parts In-Stock

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3,414

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Chip Stock

USA . 3,344 parts In-Stock

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3,344

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Anansix

USA . 2,020 parts In-Stock

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2,020

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LIBRA Elektronik GmbH

Germany . 1,613 parts In-Stock

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1,613

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Rebound Electronics

UK . 209 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 38 parts In-Stock

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38

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Inventory MP

USA . 18 parts In-Stock

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18

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Bristol Electronics

USA . 18 parts In-Stock

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Sensible Micro Corp

USA . 15 parts In-Stock

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North Shore Components

USA . 15 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 425 parts In-Stock

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$2.699

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425

$2.699

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AZTECH Wire

Italy . 482 parts In-Stock

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$10.710

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482

$10.710

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IDEA Electronic Components Group

UK . 1,198 parts In-Stock

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$20.361

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$18.324

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MKK Technologies

India . 765 parts In-Stock

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$38.287

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765

$38.287

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DigiPath Technology Company

USA . 765 parts In-Stock

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$38.287

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765

$38.287

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Native Components

USA . 888 parts In-Stock

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$447.490

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$438.540

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$434.065

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$429.590

888

$447.490

$438.540

$434.065

$429.590

Northwest PG Solutions

USA . 53 parts In-Stock

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$492.239

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53

$492.239

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Perfect Parts

USA . 5,178 parts In-Stock

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Corphita

USA . 4,814 parts In-Stock

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Parana Technologies

USA . 1,855 parts In-Stock

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$24.344

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Cyclops Electronics Ltd (Excess)

UK . 52 parts In-Stock

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Overview

Elevate your designs with the HCF4538M013TR from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile prescaler and multivibrator excels in demanding environments, offering reliability from -55 °C to 125 °C. With its compact, surface-mount design, it ensures seamless integration into your projects while maximizing performance efficiency. Experience unparalleled quality and performance that empower your applications, enhancing productivity and driving success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects the internal components from environmental factors.

Surface Mount: YES

Surface mount technology allows for more efficient manufacturing processes and smaller device footprints.

No. of Functions: 2

With two functions, this product offers versatility, making it suitable for a variety of applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space in PCB layouts and enhances design flexibility.

Nominal Supply Voltage / Vsup: 5V

A nominal voltage of 5V is standard for many applications, ensuring compatibility with a wide range of devices.

Power Supplies: 5/15V

The ability to operate at both 5V and 15V makes this product adaptable for different circuit configurations.

No. of Terminals: 16

Sixteen terminals provide ample connectivity options for input, output, and control signals.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suited for density-sensitive applications where space is at a premium.

Propagation Delay (tpd): 600 ns

A propagation delay of 600 ns ensures fast operation, suitable for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

This high operating temperature range makes it suitable for use in demanding environments.

Minimum Operating Temperature: -55 °C

The low temperature operating limit ensures functionality in extreme cold conditions, ideal for military applications.

No. of Data/Clock Inputs: 2

Two data/clock inputs provide flexibility for various signal interfacing requirements.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium plating ensures excellent connectivity and prevents corrosion over time.

Terminal Position: DUAL

Dual terminal positioning aids in easier routing on circuit boards.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a compact design in space-constrained applications.

Width: 3.9 mm

A narrow width allows for high-density component placement on PCBs.

Output Polarity: COMPLEMENTARY

Complementary output enhances flexibility in interfacing with different types of circuits.

Minimum Supply Voltage (Vsup): 3V

The capability to operate down to 3V increases compatibility with battery-operated devices.

Maximum Time At Peak Reflow Temperature: 30s

This specification indicates durability against high-temperature soldering processes during production.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature tolerance confirms robustness in heat-sensitive applications.

Length: 9.9 mm

A compact length optimizes PCB space without compromising on functionality.

Temperature Grade: MILITARY

Manufactured to military standards, ensuring high reliability in critical applications.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high-speed performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mounting on PCBs, enhancing assembly efficiency.

Packing Method: TR

The tape and reel packing method is ideal for automated assembly lines, reducing setup time.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for efficient spacing and layout on PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for proper handling during production.

Maximum Supply Voltage (Vsup): 20V

The ability to accommodate up to 20V makes this product versatile across various high-voltage applications.

Technical Specifications

Prescaler & Multivibrators HCF4538M013TR attributes and parameters. Explore more Prescaler & Multivibrators devices from STMicroelectronics

Specs

Additional Features:

RETRIGGERABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCF4538M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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