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HEF4047BTD

NXP Semiconductors

HEF4047BTD by NXP Semiconductors

HEF4047BTD by NXP Semiconductors is a Prescaler & Multivibrator IC with 14 terminals, operating at 5V. It features a propagation delay of 320ns, suitable for industrial applications. The CMOS technology and small outline package make it ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Digiode

USA . 4,017 parts In-Stock

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Anansix

USA . 2,494 parts In-Stock

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EPE Components Inc.

USA . 1,475 parts In-Stock

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Bristol Electronics

USA . 1,475 parts In-Stock

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Vyrian

USA . 1,426 parts In-Stock

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Semi Source

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Nova Conductors

Japan . 150 parts In-Stock

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Prism Electronics

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AZTECH Wire

Italy . 681 parts In-Stock

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$5.358

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Ampacity Inc.

Singapore . 640 parts In-Stock

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One Stop Electronics

USA . 443 parts In-Stock

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$36.000

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UNI Independent Distributors

Spain . 4,640 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Aranea Global

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Overview

Unlock the potential of your electronic projects with the HEF4047BTD by NXP Semiconductors. Crafted with precision and quality, this Prescaler & Multivibrator offers unparalleled reliability and performance. Ideal for a wide range of applications, this innovative product is designed to enhance your designs with ease. Experience the value and benefits that only NXP Semiconductors can provide, and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently with a common supply voltage of 5V.

Propagation Delay (tpd): 320 ns

Low propagation delay ensures fast and accurate signal processing.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

No. of Data/Clock Inputs: 2

Allows for multiple input signals to be processed simultaneously.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Technical Specifications

Prescaler & Multivibrators HEF4047BTD attributes and parameters. Explore more Prescaler & Multivibrators devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

320 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

HEF4047BTD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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