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CD4047BF3A

Texas Instruments

CD4047BF3A by Texas Instruments

CD4047BF3A by Texas Instruments is a CMOS Prescaler & Multivibrator with 14 terminals. It operates at supply voltages of 5/15V and has a max power supply current of 0.6mA. With a propagation delay of 1000ns, it is ideal for military-grade applications requiring complementary output polarity.

Median Price

$29.211

Lifecycle Status

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19

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1k+

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Chip1Stop

Japan . 1,508 parts In-Stock

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Arrow

USA . 4 parts In-Stock

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$32.170

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American Microsemiconductor Inc.

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Nova Conductors

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Digiode

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TME

Poland . 14 parts In-Stock

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Corel Iberica Componentes, S.L.

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ComSIT Distribution GmbH

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North Shore Components

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LIBRA Elektronik GmbH

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ACDS - Activité Composants Distribution Service

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LittleDiode

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Parana Technologies

USA . 2,119 parts In-Stock

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$9.309

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$9.934

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DigiPath Technology Company

USA . 1,208 parts In-Stock

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$10.251

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ChromeModa Solutions

Germany . 2,640 parts In-Stock

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IDEA Electronic Components Group

UK . 13 parts In-Stock

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Corphita

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Lixinc

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Microchip USA

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Netroflash

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Metaverse IC Inc.

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Glotronic Ltd.

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ChipstoGo Electronic ltd

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Computer Components Inc. - USA

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Overview

Elevate your electronics projects with the CD4047BF3A by Texas Instruments, a top-tier manufacturer known for producing high-quality components. This prescaler and multivibrator chip offers unparalleled performance and reliability, making it perfect for a wide range of applications. From precision timing circuits to frequency dividers, this versatile component delivers exceptional value and efficiency. Upgrade your designs today with the CD4047BF3A and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Nominal Supply Voltage / Vsup (V): 5

Compatible with commonly used voltage levels in electronic circuits, making it versatile for various applications.

No. of Terminals: 14

Offers multiple connection options for interfacing with other components, increasing flexibility in circuit design.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in environments where heat may be a concern.

Technology: CMOS

Utilizes CMOS technology, which offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Prescaler & Multivibrators CD4047BF3A attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

RETRIGGERABLE

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Data/Clock Inputs:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.6 mA

Propagation Delay (tpd):

1000 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD4047BF3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-054-6462, 5962010546462, 5962-01-015-2170, 5962010152170, 5962-01-147-5997, 5962011475997, 5962-01-194-9582, 5962011949582

NIIN

010546462, 010152170, 011475997, 011949582

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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