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SN54HC423J

Texas Instruments

SN54HC423J by Texas Instruments

SN54HC423J by Texas Instruments is a CMOS prescaler with 16 terminals and operates b/w -55°C to 125°C. It has a power supply range of 2V to 6V, making it suitable for military-grade applications requiring precise frequency division and multivibrator functions in harsh environments. The package style is in-line ceramic with rectangular shape, ideal for through-hole mounting at a terminal pitch of 2.54mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,961 parts In-Stock

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6,961

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Digiode

USA . 4,698 parts In-Stock

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4,698

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Distributors (Availability)

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AZTECH Wire

Italy . 343 parts In-Stock

1+ parts

$17.111

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343

$17.111

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Parana Technologies

USA . 2,331 parts In-Stock

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$25.538

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$26.155

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$25.538

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$26.155

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DigiPath Technology Company

USA . 1,799 parts In-Stock

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$28.120

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1,799

$28.120

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ChromeModa Solutions

Germany . 5,911 parts In-Stock

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$28.694

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$23.529

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5,911

$28.694

$23.529

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IDEA Electronic Components Group

UK . 1,456 parts In-Stock

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$28.694

100+ parts

$27.259

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$25.825

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1,456

$28.694

$27.259

$25.825

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One Stop Electronics

USA . 1,261 parts In-Stock

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$30.000

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1,261

$30.000

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Corphita

USA . 1,506 parts In-Stock

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1,506

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Overview

Unlock the power of precision with the SN54HC423J by Texas Instruments. This top-of-the-line Prescaler & Multivibrator offers unparalleled quality and reliability, thanks to TI's stellar reputation for innovation and excellence. Whether you're in the military, aerospace, or industrial sector, this versatile component is sure to exceed your expectations. With a wide operating temperature range and dual terminal position, the SN54HC423J is designed to deliver exceptional performance in even the most demanding environments. Trust Texas Instruments to provide the cutting-edge technology you need to stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good stability and durability, which is essential for electronic components in high temperature environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and compact packaging, suitable for saving space in electronic circuits.

Power Supplies (V): 2/6

Supports a wide range of power supply voltages, making it versatile and compatible with various electronic systems.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and flexibility in designing circuits.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to integrate into existing circuit layouts and provides a neat and organized appearance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for demanding applications where heat resistance is crucial.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures ensures reliable performance even in extreme environmental conditions.

Terminal Position: DUAL

Dual terminal positioning allows for improved signal transmission and reduced crosstalk in the circuit.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures robust performance in harsh environments and military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring reliability in various electronic applications.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for compatibility with standard electronic components and easy integration into PCB designs.

Technical Specifications

Prescaler & Multivibrators SN54HC423J attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54HC423J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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