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HCF4047M013TR

STMicroelectronics

HCF4047M013TR by STMicroelectronics

HCF4047M013TR by STMicroelectronics is a CMOS multivibrator with a 5V nominal supply and operates b/w -55 °C to 125 °C. It features a propagation delay of 1000 ns and supports dual data/clock inputs. Ideal for military applications, it comes in a compact SO package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT USA

USA . 12,500 parts In-Stock

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12,500

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ComSIT Distribution GmbH

Germany . 9,375 parts In-Stock

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9,375

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Chip Stock

USA . 6,510 parts In-Stock

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6,510

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Digiode

USA . 4,904 parts In-Stock

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4,904

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Anansix

USA . 2,846 parts In-Stock

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Vyrian

USA . 2,460 parts In-Stock

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2,460

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LIBRA Elektronik GmbH

Germany . 390 parts In-Stock

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390

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Distributors (Availability)

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Microchip USA

USA . 279 parts In-Stock

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$2.758

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279

$2.758

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AZTECH Wire

Italy . 631 parts In-Stock

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$13.810

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631

$13.810

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Native Components

USA . 976 parts In-Stock

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$14.250

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$14.250

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Northwest PG Solutions

USA . 1,125 parts In-Stock

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$15.675

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$14.108

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$15.675

$14.108

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IDEA Electronic Components Group

UK . 778 parts In-Stock

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$22.292

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$20.062

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778

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MKK Technologies

India . 2,101 parts In-Stock

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$41.918

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$41.918

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DigiPath Technology Company

USA . 2,101 parts In-Stock

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$41.918

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$41.918

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,126 parts In-Stock

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Parana Technologies

USA . 1,171 parts In-Stock

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$26.653

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Elevate your designs with the HCF4047M013TR from STMicroelectronics, a leader in innovation and reliability. This advanced prescaler and multivibrator delivers exceptional performance across various applications, ensuring precision in timing and frequency management. Engineered with top-notch quality and military-grade durability, it thrives in demanding environments, making it ideal for automotive, industrial, and consumer electronics. Experience unmatched value and efficiency—choose STMicroelectronics for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and protection for the components, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient board layout and optimized routing for signal integrity.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V is commonly used in digital circuits, ensuring compatibility with a wide range of systems.

Power Supplies: 5/15 V

The ability to operate at multiple voltage levels enhances flexibility in different circuit designs and applications.

No. of Terminals: 14

With 14 terminals, this product provides ample connections for various inputs and outputs, supporting complex operations.

Package Style (Meter): SMALL OUTLINE

The small outline package enables a compact form factor for high-density designs without sacrificing performance.

Propagation Delay (tpd): 1000 ns

A propagation delay of 1000 ns is suitable for fast-switching applications, ensuring timely signal processing.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating allows this component to be used in high-temperature environments.

Minimum Operating Temperature: -55 °C

This low minimum operating temperature makes the product suitable for extreme conditions and outdoor applications.

No. of Data/Clock Inputs: 2

Having two inputs allows for more complex signaling and control schemes, enhancing functionality in digital circuits.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish improves conductivity and ensures reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning aids in effective board layout and ease of assembly.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a low-profile design, beneficial for compact electronic assemblies.

Width: 3.9 mm

The narrow width helps minimize board space usage, allowing for a more compact design.

Output Polarity: COMPLEMENTARY

Complementary output polarity allows for better performance in certain applications, especially in signal inversion.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate down to 3V expands its usability in low-power applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum time at peak reflow temperature of 40 seconds ensures compatibility with various assembly processes.

Peak Reflow Temperature: 260 °C

The capability to withstand high reflow temperatures indicates robust thermal performance during soldering.

Length: 8.65 mm

The compact length supports space-efficient designs, making it suitable for modern electronic devices.

Temperature Grade: MILITARY

A military grade rating ensures reliability and performance under extreme conditions, suitable for demanding applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making it efficient for digital circuits.

Terminal Form: GULL WING

The gull-wing terminal form simplifies PCB mounting and enhances solder joint reliability.

Packing Method: TR

The TR (Tape and Reel) packing method allows for automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers compatibility with standard assembly equipment, ensuring ease of manufacturing.

Maximum Supply Voltage (Vsup): 20 V

The capability to handle up to 20V allows for use in a broad range of applications, including those with higher voltage requirements.

Technical Specifications

Prescaler & Multivibrators HCF4047M013TR attributes and parameters. Explore more Prescaler & Multivibrators devices from STMicroelectronics

Specs

Additional Features:

RETRIGGERABLE; FREE RUNNING/GATABLE ASTABLE OPERATING MODES WITH OSCILLATOR OUTPUT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

1000 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

HCF4047M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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