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HCF4098M013TR

STMicroelectronics

HCF4098M013TR by STMicroelectronics

HCF4098M013TR by STMicroelectronics is a CMOS multivibrator with dual functions, operating at 5V and featuring a propagation delay of 500 ns. It supports temperatures from -55 °C to 125 °C, making it ideal for military applications. This compact surface-mount device has 16 terminals and offers complementary output polarity.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Chip Stock

USA . 208,690 parts In-Stock

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Vyrian

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LIBRA Elektronik GmbH

Germany . 4,922 parts In-Stock

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Anansix

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Digiode

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Bristol Electronics

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Prism Electronics

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Microchip USA

USA . 209 parts In-Stock

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AZTECH Wire

Italy . 1,169 parts In-Stock

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$14.840

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IDEA Electronic Components Group

UK . 879 parts In-Stock

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$23.922

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MKK Technologies

India . 1,011 parts In-Stock

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$44.983

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DigiPath Technology Company

USA . 1,011 parts In-Stock

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Kepictronics

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A-Z Elektronik GmbH

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S.R.D Solutions

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Alle Elektronik GmbH

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Parana Technologies

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Native Components

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Cyclops Electronics Ltd (Excess)

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Corphita

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Northwest PG Solutions

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Overview

Unlock the potential of your designs with the HCF4098M013TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile prescaler and multivibrator excels in reliability and performance, operating seamlessly across a wide temperature range for demanding applications. With its compact surface mount design and dual functionality, it's perfect for enhancing efficiency in communication systems, industrial controls, and consumer electronics. Elevate your projects with the trusted innovation and unmatched quality that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, which is essential for longevity in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and is suitable for automated assembly, making it ideal for modern electronic devices.

No. of Functions: 2

Having two functions integrated into one device saves space and reduces component count in circuit design.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized design that is versatile for various PCB layouts.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal supply voltage of 5 V simplifies power management and compatibility with common low-power systems.

Power Supplies: 5/15 V

The versatility of operating on 5V and 15V is beneficial for applications requiring different power levels.

No. of Terminals: 16

With 16 terminals, this product offers sufficient connections for complex circuits while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates low-profile applications and maximizes board space.

Propagation Delay (tpd): 500 ns

A propagation delay of 500 ns allows for fast signal processing, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in extreme conditions and enhances the device's application range.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature guarantees functionality in cold environments, making it suitable for military and aerospace applications.

No. of Data/Clock Inputs: 2

Having two data/clock inputs allows for flexible configuration in multi-channel applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish improves solderability and provides protection against corrosion, ensuring robust electrical connections.

Terminal Position: DUAL

Dual terminal positioning enhances layout versatility, allowing for various PCB designs.

Maximum Seated Height: 1.75 mm

The low seated height ensures compatibility with low-profile designs without compromising performance.

Width: 3.9 mm

A narrow width allows for density in PCB layouts, which is advantageous for compact devices.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides robust signal properties suitable for various circuit configurations.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum of 3V allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification assures compatibility with modern soldering processes, ensuring reliable solder joints.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature indicates robustness during manufacturing processes, allowing for versatility in assembly.

Length: 9.9 mm

The compact length contributes to efficient use of PCB space, supporting high-density designs.

Temperature Grade: MILITARY

Being MILITARY grade means this device meets stringent reliability requirements, making it ideal for defense and aerospace applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration capabilities, enhancing circuit efficiency.

Terminal Form: GULL WING

Gull wing terminals ensure strong mechanical connections and provide ease of automated assembly.

Packing Method: TR

The tape and reel packing method facilitates easy handling and efficient automated assembly in high-volume production.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for a compact layout while providing ample space for soldering.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, suitable for standard handling procedures.

Maximum Supply Voltage (Vsup): 20 V

The capability to endure up to 20 V indicates versatile application possibilities in varying circuit designs.

Technical Specifications

Prescaler & Multivibrators HCF4098M013TR attributes and parameters. Explore more Prescaler & Multivibrators devices from STMicroelectronics

Specs

Additional Features:

RETRIGGERABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

500 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCF4098M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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