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HCF4054BM

STMicroelectronics

HCF4054BM by STMicroelectronics

STMicroelectronics' HCF4054BM is a CMOS graphics display driver with 16 terminals, operating at -40 to 85 °C. It supports segment display mode, with power supplies of 5/15V and max supply current of 0.6mA. Ideal for industrial applications requiring small outline surface-mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,848 parts In-Stock

1+ parts

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4,848

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Vyrian

USA . 1,331 parts In-Stock

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1,331

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Anansix

USA . 613 parts In-Stock

1+ parts

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613

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Electro Mavin

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 400 parts In-Stock

1+ parts

$0.924

100+ parts

-

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400

$0.924

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Northwest PG Solutions

USA . 38 parts In-Stock

1+ parts

$1.016

100+ parts

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38

$1.016

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IDEA Electronic Components Group

UK . 1,832 parts In-Stock

1+ parts

$13.265

100+ parts

-

1k+ parts

$11.938

10k+ parts

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1,832

$13.265

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$11.938

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MKK Technologies

India . 1,220 parts In-Stock

1+ parts

$24.943

100+ parts

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1,220

$24.943

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DigiPath Technology Company

USA . 1,220 parts In-Stock

1+ parts

$24.943

100+ parts

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1,220

$24.943

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Corphita

USA . 2,740 parts In-Stock

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2,740

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Parana Technologies

USA . 83 parts In-Stock

1+ parts

-

100+ parts

$15.860

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83

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$15.860

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Overview

Elevate your display performance with the STMicroelectronics HCF4054BM Graphics Display Driver. Crafted with precision and expertise by a renowned manufacturer, this product offers unparalleled quality and reliability. Ideal for a variety of applications, this segment display driver boasts a sleek design, small form factor, and low power consumption. Experience seamless operation and enhanced visual output with the HCF4054BM, providing exceptional value and benefits to customers seeking top-tier performance in their electronic displays. Choose excellence, choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read information, making it suitable for various applications.

Surface Mount: YES

Surface mount installation makes it easy to integrate the product into different electronic devices.

Power Supplies (V): 5/15

Versatile power supply options allow for compatibility with a range of systems and devices.

No. of Terminals: 16

Having 16 terminals provides connectivity options for multiple connections and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact design in electronic devices.

No. of Backplanes: 0-BP

Not having backplanes simplifies the design and operation of the product, reducing complexity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand various environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliability in both hot and cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and electrical conductivity, enhancing overall performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving efficiency and reliability.

Maximum Supply Current: 0.6 mA

The low maximum supply current helps in reducing power consumption and heat dissipation.

No. of Segments: 4

Having 4 segments allows for displaying multiple information simultaneously, enhancing user experience.

Terminal Pitch: 1.27 mm

The small terminal pitch enables compact design and efficient connectivity within the device.

Technical Specifications

Graphics Display Drivers HCF4054BM attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Backplanes:

0-BP

No. of Segments:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HCF4054BM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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