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HCF4054BC1

STMicroelectronics

HCF4054BC1 by STMicroelectronics

HCF4054BC1 by STMicroelectronics is a graphics display driver with dot matrix display mode and parallel data input. It operates at 3-15 V, -40 to 85 °C, suitable for industrial applications. The chip carrier package style has 20 terminals in a square shape, making it ideal for liquid crystal display drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,478

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-

-

-

Anansix

USA . 1,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,158

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-

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Vyrian

USA . 926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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926

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 963 parts In-Stock

1+ parts

$4.341

100+ parts

-

1k+ parts

$3.907

10k+ parts

-

963

$4.341

-

$3.907

-

MKK Technologies

India . 763 parts In-Stock

1+ parts

$8.162

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$8.162

-

-

-

DigiPath Technology Company

USA . 763 parts In-Stock

1+ parts

$8.162

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$8.162

-

-

-

Native Components

USA . 792 parts In-Stock

1+ parts

$64.900

100+ parts

-

1k+ parts

-

10k+ parts

$62.304

792

$64.900

-

-

$62.304

Northwest PG Solutions

USA . 131 parts In-Stock

1+ parts

$71.390

100+ parts

-

1k+ parts

-

10k+ parts

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131

$71.390

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-

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Corphita

USA . 1,750 parts In-Stock

1+ parts

-

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1,750

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Parana Technologies

USA . 368 parts In-Stock

1+ parts

-

100+ parts

$5.190

1k+ parts

-

10k+ parts

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368

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$5.190

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Overview

Elevate your graphics display experience with the HCF4054BC1 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics brings you cutting-edge technology for your dot matrix displays. With a sleek chip carrier package and industrial-grade temperature rating, this display driver offers unmatched reliability and performance. From parallel data input mode to matte tin terminal finish, every detail is designed to enhance user experience. Whether you're creating dynamic signage or interactive kiosks, the HCF4054BC1 delivers exceptional quality and value, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the graphics display driver.

Display Mode: DOT MATRIX

Dot matrix display mode offers high resolution and clear visual output for graphics and text.

Data Input Mode: PARALLEL

Parallel data input mode allows for fast and efficient communication between the display driver and external devices.

Maximum Supply Voltage: 15 V

Higher maximum supply voltage ensures compatibility with a wide range of power sources.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for reliable connections.

Technology: CMOS

CMOS technology offers low power consumption and high reliability for consistent performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes this display driver suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without performance issues.

Technical Specifications

Graphics Display Drivers HCF4054BC1 attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

PARALLEL

Display Mode:

DOT MATRIX

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.9662 mm

Multiplexed Display Capability:

NO

No. of Backplanes:

0-BP

No. of Functions:

1

No. of Segments:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.6 mA

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

HCF4054BC1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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