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HCF4056BE

STMicroelectronics

HCF4056BE by STMicroelectronics

HCF4056BE by STMicroelectronics is a CMOS graphics display driver with 16 terminals, operating at temperatures from -40 to 85 °C. It supports 7 segments and requires power supplies of 5/15V. Ideal for industrial applications requiring segment display mode in an inline package style.

Median Price

$0.563

Lifecycle Status

Suppliers In-Stock

19

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Vyrian

USA . 4,389 parts In-Stock

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Digiode

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QIE Inc.

USA . 3,908 parts In-Stock

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Anansix

USA . 878 parts In-Stock

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ComSIT Distribution GmbH

Germany . 795 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 650 parts In-Stock

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Bristol Electronics

USA . 650 parts In-Stock

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$0.563

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$0.420

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650

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$0.563

$0.420

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Dan-Mar Components

USA . 650 parts In-Stock

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650

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MRC Electronics

USA . 128 parts In-Stock

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ABC Electronics Ltd.

UK . 120 parts In-Stock

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Inventory MP

USA . 50 parts In-Stock

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50

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Infinite Electronics LLP

India . 50 parts In-Stock

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50

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Corel Iberica Componentes, S.L.

Spain . 31 parts In-Stock

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ECAB

Sweden . 27 parts In-Stock

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ICP Electronique

France . 22 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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GES GmbH

Germany . 6 parts In-Stock

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Sinequanon

UK . 5 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,357 parts In-Stock

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$11.225

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$10.102

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MKK Technologies

India . 2,009 parts In-Stock

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$21.108

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$21.108

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DigiPath Technology Company

USA . 2,009 parts In-Stock

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$21.108

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,074 parts In-Stock

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Corphita

USA . 4,844 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,716 parts In-Stock

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Northwest PG Solutions

USA . 1,623 parts In-Stock

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Parana Technologies

USA . 1,584 parts In-Stock

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Assy Fe

Spain . 818 parts In-Stock

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Native Components

USA . 462 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 148 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 91 parts In-Stock

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Glotronic Ltd.

UK . 73 parts In-Stock

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Overview

Unleash the power of high-quality graphics display drivers with the HCF4056BE from STMicroelectronics. Designed to deliver exceptional performance and reliability, this product is perfect for a wide range of applications. Whether you're in need of advanced graphics capabilities for your project or looking to enhance the visual experience of your devices, the HCF4056BE has got you covered. With STMicroelectronics' reputation for excellence in manufacturing, you can trust that you're getting a top-of-the-line product that exceeds expectations. Upgrade your displays today with the HCF4056BE and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the display driver.

Display Mode: SEGMENT

Segment display mode allows for individual segments to be lit up or turned off, providing flexibility in displaying information.

Power Supplies (V): 5/15

This display driver can accommodate multiple power supply voltages, making it versatile for various applications.

No. of Terminals: 16

With 16 terminals, this display driver can support a wide range of connections for different display configurations.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without performance degradation.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability for easy installation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the display driver energy-efficient and reliable.

Maximum Supply Current: 0.6 mA

The low maximum supply current helps conserve energy and prevents overheating in the system.

No. of Segments: 7

With 7 segments, this display driver can display a wide range of characters and symbols for diverse applications.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connection to standard electronic components and PCBs.

Technical Specifications

Graphics Display Drivers HCF4056BE attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Backplanes:

0-BP

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.6 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4056BE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-15-111-6693, 5962151116693

NIIN

151116693

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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