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HCF4511BE

STMicroelectronics

HCF4511BE by STMicroelectronics

HCF4511BE by STMicroelectronics is a CMOS graphics display driver with 7 segments. It operates at temperatures ranging from -40°C to 85°C and requires power supplies of 5V or 15V. This IC is commonly used in industrial applications for segment display mode in a rectangular package style.

Median Price

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Digiode

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Anansix

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ComSIT Distribution GmbH

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Vyrian

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First Choice Components Inc.

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ECAB

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Nova Conductors

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DF Sales Co.

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DF Sales Co.

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Corel Iberica Componentes, S.L.

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Fibra_Brandt Electronic GMBH

Germany . 50 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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Manoshevitz Elec. Sales

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LittleDiode

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Electro Mavin

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Electronic Expediters

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J2 Sourcing AB

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Mentor Electronics Marketing, LLC

USA . 20 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 19 parts In-Stock

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LWI Electronics Inc

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ACDS - Activité Composants Distribution Service

France . 14 parts In-Stock

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Holdelec - ElecDif-Pro

France . 14 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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GES GmbH

Germany . 10 parts In-Stock

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Goldney Electronics S.L.

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MISTER SPROCKETS

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Sinequanon

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IDEA Electronic Components Group

UK . 1,662 parts In-Stock

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$4.357

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MKK Technologies

India . 2,086 parts In-Stock

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DigiPath Technology Company

USA . 2,086 parts In-Stock

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AZTECH Wire

Italy . 342 parts In-Stock

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Lixinc

USA . 12,631 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,951 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,967 parts In-Stock

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Argo Parts USA

USA . 3,515 parts In-Stock

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Corphita

USA . 3,270 parts In-Stock

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Continental Prestige Electronics

USA . 2,793 parts In-Stock

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Assy Fe

Spain . 1,022 parts In-Stock

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Parana Technologies

USA . 915 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 323 parts In-Stock

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Kepictronics

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Overview

Enhance your graphics display projects with the HCF4511BE by STMicroelectronics! Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge solutions in the field of Graphics Display Drivers. This versatile component offers a wide range of applications, from industrial automation to consumer electronics. With a focus on value and performance, the HCF4511BE provides customers with a seamless user experience and unmatched benefits. Upgrade your designs today with STMicroelectronics' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable and rugged applications.

Display Mode: SEGMENT

The segment display mode allows for clear and easy viewing of information, making it suitable for applications where specific segments need to be highlighted or emphasized.

Power Supplies (V): 5/15

The dual power supply option of 5/15V provides flexibility in powering the driver, accommodating different voltage requirements for varied applications.

No. of Terminals: 16

With 16 terminals, this driver can easily connect to various components and peripherals, offering versatility in connectivity options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the driver can function reliably in challenging environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the driver to operate efficiently in cold environments, making it suitable for a wide range of applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the driver.

No. of Segments: 7

Having 7 segments allows for displaying a wide range of alphanumeric characters and symbols, making it versatile for various display applications.

Technical Specifications

Graphics Display Drivers HCF4511BE attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Additional Features:

COMMON-CATHODE

Display Mode:

SEGMENT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4511BE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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