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HCF4054BM1

STMicroelectronics

HCF4054BM1 by STMicroelectronics

STMicroelectronics' HCF4054BM1 is a CMOS graphics display driver with 16 terminals, operating voltage range of 3-20V. It supports segment display mode, parallel data input, and liquid crystal displays. Ideal for military-grade applications with temperature range -55 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,870 parts In-Stock

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2,870

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Vyrian

USA . 1,523 parts In-Stock

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1,523

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Digiode

USA . 1,032 parts In-Stock

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1,032

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ECAB

Sweden . 82 parts In-Stock

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82

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Distributors (Availability)

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Native Components

USA . 335 parts In-Stock

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$0.316

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$0.303

335

$0.316

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$0.303

Northwest PG Solutions

USA . 1,186 parts In-Stock

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$0.348

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$0.307

1,186

$0.348

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$0.307

IDEA Electronic Components Group

UK . 1,334 parts In-Stock

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$12.414

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$11.173

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$12.414

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$11.173

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MKK Technologies

India . 1,454 parts In-Stock

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$23.345

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$23.345

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DigiPath Technology Company

USA . 1,454 parts In-Stock

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$23.345

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Parana Technologies

USA . 1,918 parts In-Stock

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$14.843

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1,918

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$14.843

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Assy Fe

Spain . 1,352 parts In-Stock

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Corphita

USA . 404 parts In-Stock

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Overview

Discover the superior quality and reliability of the HCF4054BM1 by STMicroelectronics, a leading manufacturer in the electronics industry. As part of the Graphics Display Drivers category, this product offers seamless integration and exceptional performance for various applications. With its advanced technology and MILITARY-grade temperature grade, customers can trust in the longevity and efficiency of this product. Upgrade your display systems with ease, thanks to the value and benefits that the HCF4054BM1 provides. Trust in STMicroelectronics for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable electronics.

Display Mode: SEGMENT

Segment display mode allows for clear and precise information display, making it suitable for applications requiring specific data presentation.

Data Input Mode: PARALLEL

Parallel data input mode ensures fast and efficient communication with the graphics display, enhancing overall performance.

Surface Mount: YES

Surface mount capability simplifies the assembly process and enables compact design, saving space in electronic devices.

Maximum Supply Voltage: 20 V

Support for a high supply voltage of 20V allows for versatility in power source compatibility.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into circuit boards and provides a standardized form factor for compatibility.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5V and 15V) offers flexibility in application requirements and power management.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in space-saving design and efficient use of board real estate.

No. of Backplanes: 0-BP

The absence of backplanes simplifies the product design and reduces complexity in system integration.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage of 3V ensures energy efficiency and compatibility with low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance of 125 °C enables reliable operation in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55 °C ensures functionality in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent corrosion resistance and ensures long-term reliability in varying environments.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and enhances connection stability for reliable performance.

Maximum Seated Height: 1.75 mm

Low maximum seated height of 1.75mm enables slim and compact device designs.

Width: 3.9 mm

Narrow width of 3.9mm contributes to space-efficient PCB layout and allows for compact device form factor.

Length: 9.9 mm

Compact length of 9.9mm facilitates space-saving integration within electronic devices.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in rugged conditions and harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and robust mechanical connections for enhanced reliability.

Maximum Supply Current: 0.6 mA

Low maximum supply current requirement of 0.6mA ensures energy-efficient operation and reduces power consumption.

No. of Segments: 4

The presence of 4 segments provides basic display capabilities for essential information presentation.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27mm allows for compact design and high-density mounting on PCBs.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Built-in interface IC for driving liquid crystal displays simplifies connection and control, making it suitable for display applications.

Technical Specifications

Graphics Display Drivers HCF4054BM1 attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

PARALLEL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Multiplexed Display Capability:

NO

No. of Backplanes:

0-BP

No. of Functions:

1

No. of Segments:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.6 mA

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF4054BM1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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