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HCF40109BE

STMicroelectronics

HCF40109BE by STMicroelectronics

HCF40109BE by STMicroelectronics is a CMOS interface IC with 4 functions, operating at -40 to 85 °C. It has a supply voltage range of 3-15 V and comes in an industrial-grade rectangular package suitable for various function interface applications.

Median Price

$4.390

Lifecycle Status

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20

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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Cyclops Electronics Ltd

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Vyrian

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Digiode

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Anansix

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ComSIT Distribution GmbH

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Fibra_Brandt Electronic GMBH

Germany . 144 parts In-Stock

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ECAB

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LIBRA Elektronik GmbH

Germany . 81 parts In-Stock

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Diverse Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 60 parts In-Stock

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LittleDiode

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A&K Electronics

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Rotakorn

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Bristol Electronics

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Whistler Technology

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Prism Electronics

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Electronic Expediters

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GES GmbH

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Component Electronics Inc.

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Northwest PG Solutions

USA . 889 parts In-Stock

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IDEA Electronic Components Group

UK . 1,235 parts In-Stock

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MKK Technologies

India . 797 parts In-Stock

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DigiPath Technology Company

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Perfect Parts

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Authorized Procurement Solutions

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Corphita

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Parana Technologies

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Native Components

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Assy Fe

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Overview

Unlock endless possibilities with the HCF40109BE by STMicroelectronics, a high-quality Other Function Interface IC that offers unparalleled value to customers. Manufactured by industry leader STMicroelectronics, this versatile component boasts 4 functions, a wide operating temperature range, and a durable plastic/epoxy package body. Whether you're designing consumer electronics, industrial equipment, or automotive systems, the HCF40109BE delivers reliable performance and efficiency. Elevate your designs with the exceptional quality and advantages that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to environmental factors, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 15 V

Can handle a wide range of supply voltages, making it versatile and compatible with various systems and applications.

No. of Functions: 4

Offers multiple functions in a single package, saving space and reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape is typically easier to integrate into existing designs and circuit layouts.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals, allowing for flexibility in design and functionality.

Package Style (Meter): IN-LINE

In-line package style is commonly used and easy to mount on circuit boards.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, making it energy efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes it suitable for industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable performance in cold environments or during temperature changes.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connections, improving reliability and stability in operation.

Maximum Seated Height: 5.1 mm

Low profile design with maximum seated height of 5.1 mm saves space and enables compact installations.

Width: 7.62 mm

Compact width of 7.62 mm allows for easy integration into tight spaces or crowded circuit boards.

Length: 20 mm

Standard length of 20 mm for convenient placement and compatibility with various mounting options.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions typically found in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems and devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides a sturdy and reliable connection, suitable for applications where vibration or mechanical stress is a concern.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with most common power sources and system requirements.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm allows for easy soldering and connection to standard PCB layouts.

Interface IC Type: INTERFACE CIRCUIT

Dedicated interface circuit type specifically designed for efficient communication between different components and systems.

Technical Specifications

Other Function Interface ICs HCF40109BE attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Additional Features:

LG-MAX

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

Length:

20 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.1 mm

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF40109BE Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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