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HCF40109BM1

STMicroelectronics

HCF40109BM1 by STMicroelectronics

HCF40109BM1 by STMicroelectronics is a CMOS interface IC with 16 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 3-20 V and is suitable for military-grade applications due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 4,193 parts In-Stock

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Anansix

USA . 1,247 parts In-Stock

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Vyrian

USA . 959 parts In-Stock

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Cyclops Electronics Ltd

UK . 82 parts In-Stock

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Pegasus Components GmbH

Germany . 31 parts In-Stock

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IDEA Electronic Components Group

UK . 32 parts In-Stock

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$3.765

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$3.388

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32

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$3.388

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MKK Technologies

India . 1,768 parts In-Stock

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$7.079

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DigiPath Technology Company

USA . 1,768 parts In-Stock

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$7.079

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Native Components

USA . 86 parts In-Stock

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$259.930

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$254.731

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$252.132

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$249.533

86

$259.930

$254.731

$252.132

$249.533

Northwest PG Solutions

USA . 1,072 parts In-Stock

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$285.923

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,362 parts In-Stock

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Parana Technologies

USA . 804 parts In-Stock

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GreenTree Electronics

Israel . 82 parts In-Stock

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Overview

Enhance your electronic designs with the HCF40109BM1 by STMicroelectronics, a top-tier manufacturer known for their superior quality and innovation. This interface IC boasts a wide range of applications in various industries, offering customers unmatched value and benefits. With its small outline package, dual terminal position, and military-grade temperature rating, this product delivers reliable performance in demanding environments. Elevate your projects with the cutting-edge technology and exceptional reliability of the HCF40109BM1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuit, making it suitable for a range of applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 20 V

Provides flexibility in power supply options and can accommodate a wide range of voltage inputs.

Package Shape: RECTANGULAR

Allows for efficient use of space on a PCB and facilitates easy integration into existing designs.

Power Supplies (V): 3/15

Supports multiple power supply options, offering versatility in system design and integration.

No. of Terminals: 16

Sufficient number of terminals for connecting to external components or peripherals, enhancing the functionality of the IC.

Package Style (Meter): SMALL OUTLINE

Compact size allows for high-density mounting and saves space on the PCB.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in low-power applications, conserving energy.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme temperature environments, providing versatility in application usage.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish ensures long-term reliability and stable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection options.

Maximum Seated Height: 1.75 mm

Low profile design enables installation in compact devices or systems with height constraints.

Width: 3.9 mm

Compact width facilitates space-saving integration on the PCB.

Length: 9.9 mm

Optimal length for efficient placement on the PCB and compatibility with standard mounting configurations.

Temperature Grade: MILITARY

Built to withstand rugged conditions and harsh environments, making it suitable for military applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds for efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical connection and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage simplifies power requirements and compatibility with existing systems.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and connection to the PCB, enhancing assembly efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, ensuring reliable performance in humid environments.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing between different components or systems, enabling seamless communication and data exchange.

Technical Specifications

Other Function Interface ICs HCF40109BM1 attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF40109BM1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-443-8191, 5962144438191

NIIN

144438191

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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