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HCF4054BF

STMicroelectronics

HCF4054BF by STMicroelectronics

HCF4054BF by STMicroelectronics is a CMOS IC with 16 terminals, operating at -40 to 85 °C. It has a supply voltage of 5/15V and low current draw of 0.6mA. Ideal for industrial applications requiring segment display mode in ceramic package with tin-lead finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,364 parts In-Stock

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Anansix

USA . 2,732 parts In-Stock

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Vyrian

USA . 2,394 parts In-Stock

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Lakeview Electronics

USA . 300 parts In-Stock

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Resion

USA . 4 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 286 parts In-Stock

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$0.276

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$0.265

286

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$0.265

Northwest PG Solutions

USA . 2,020 parts In-Stock

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$0.304

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$0.268

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$0.304

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$0.268

IDEA Electronic Components Group

UK . 1,274 parts In-Stock

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$11.240

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$10.116

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$10.116

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MKK Technologies

India . 1,302 parts In-Stock

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$21.135

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DigiPath Technology Company

USA . 1,302 parts In-Stock

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$21.135

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Parana Technologies

USA . 2,309 parts In-Stock

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$13.439

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$13.439

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Corphita

USA . 57 parts In-Stock

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Overview

Upgrade your electronics with the high-quality HCF4054BF by STMicroelectronics. This versatile interface IC offers a range of applications in various industries, providing seamless connectivity and functionality. Manufactured by a trusted leader in the industry, this product guarantees reliability, durability, and top-notch performance. Experience the value and benefits of this innovative component, and take your projects to the next level with the HCF4054BF.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and mechanical strength, making the product durable and reliable.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read information display for the user.

Power Supplies (V): 5/15

Provides flexibility in power supply options, allowing for compatibility with different systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components or peripherals.

Package Style (Meter): IN-LINE

In-line package style saves space and allows for easy integration into existing setups.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures stable performance even in harsh conditions.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes it suitable for a variety of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to efficient operation.

Technical Specifications

Other Function Interface ICs HCF4054BF attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

No. of Backplanes:

0-BP

No. of Segments:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.6 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4054BF Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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