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FDA903D-EHX

STMicroelectronics

FDA903D-EHX by STMicroelectronics

FDA903D-EHX by STMicroelectronics is a Class D audio amplifier with 80W output power and low harmonic distortion of just 0.01%. It operates in extreme temperatures from -40 °C to 125 °C, making it ideal for automotive applications. This compact, surface-mount device features a dual terminal design for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,986 parts In-Stock

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7,986

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Digiode

USA . 4,461 parts In-Stock

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4,461

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Anansix

USA . 1,520 parts In-Stock

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1,520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 828 parts In-Stock

1+ parts

$0.499

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-

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828

$0.499

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Northwest PG Solutions

USA . 2,353 parts In-Stock

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$0.549

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-

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$0.484

2,353

$0.549

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$0.484

IDEA Electronic Components Group

UK . 1,517 parts In-Stock

1+ parts

$3.132

100+ parts

-

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$2.819

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1,517

$3.132

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$2.819

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Vigor

Singapore . 484 parts In-Stock

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$5.520

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484

$5.520

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MKK Technologies

India . 1,668 parts In-Stock

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$5.889

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1,668

$5.889

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DigiPath Technology Company

USA . 1,668 parts In-Stock

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$5.889

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1,668

$5.889

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Microchip USA

USA . 1,918 parts In-Stock

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$6.894

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1,918

$6.894

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AZTECH Wire

Italy . 807 parts In-Stock

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$14.170

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807

$14.170

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iodParts Technologies Inc.

India . 58,000 parts In-Stock

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58,000

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Corphita

USA . 4,139 parts In-Stock

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Parana Technologies

USA . 2,213 parts In-Stock

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$3.744

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2,213

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$3.744

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Overview

Experience unparalleled audio excellence with the FDA903D-EHX from STMicroelectronics, a leader in innovative technology. This Class D audio amplifier offers remarkable efficiency and crystal-clear sound quality, perfect for automotive and consumer electronics applications. Engineered to exceed AEC-Q100 standards, it guarantees reliability under extreme conditions. Elevate your projects with a powerful solution that combines exceptional performance, compact design, and trusted STMicroelectronics quality, ensuring lasting value for your audio needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials in the package body ensures durability and protection from environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller and lighter designs, facilitating easier integration into compact devices.

Screening Level: AEC-Q100

Being AEC-Q100 certified indicates that the amplifier meets stringent automotive quality and reliability standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient PCB layout and provides flexibility in design.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D technology allows for high efficiency and lower power consumption, making this amplifier ideal for battery-powered or energy-sensitive applications.

Harmonic Distortion: 0.01 %

A low harmonic distortion value ensures high audio fidelity, providing clear and accurate sound reproduction.

No. of Terminals: 36

The 36 terminals offer extensive connectivity options for various functionalities, enhancing the versatility of the amplifier.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline with heat sink capability allows for efficient thermal management, accommodating high power output in a compact design.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating enables the amplifier to perform reliably in demanding thermal environments.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the amplifier to function effectively in extreme conditions, enhancing its reliability in various applications.

Terminal Position: DUAL

Dual terminal positioning facilitates better alignment in PCB assembly, promoting manufacturability.

Nominal Output Power: 80 W

With a nominal output power of 80 W, this amplifier can drive high-performance audio systems effectively, making it suitable for demanding audio applications.

Maximum Seated Height: 2.45 mm

A low seated height allows for better space management on PCBs, enabling slim device designs.

Width: 7.5 mm

A compact width contributes to space-efficient designs, allowing integration into tight spaces within a product.

Minimum Supply Voltage (Vsup): 3.3 V

Low supply voltage means lower power requirements, allowing operation in energy-efficient applications.

Length: 10.3 mm

A short length aids in compact designs, accommodating smaller devices without compromising performance.

Technology: BCDMOS

BCDMOS technology combines the advantages of both bipolar and CMOS transistors, resulting in high performance and efficiency characteristics.

Terminal Form: GULL WING

Gull wing terminals provide good solderability and mechanical support during assembly, enhancing reliability.

Terminal Pitch: 0.5 mm

A tight terminal pitch allows for increased density of connections on PCBs, saving space while ensuring robust performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate sensitivity to moisture, providing adequate protection and making it suitable for regular handling processes.

Maximum Supply Voltage (Vsup): 18 V

A high maximum supply voltage allows this amplifier to provide powerful output, suitable for high-performance audio applications.

Technical Specifications

Audio & Video Amplifiers FDA903D-EHX attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

80 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

FDA903D-EHX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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