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FDA903Q-V0T

STMicroelectronics

FDA903Q-V0T by STMicroelectronics

FDA903Q-V0T by STMicroelectronics is a Class D audio amplifier designed for automotive applications, featuring AEC-Q100 screening. It operates b/w -40 °C to 125 °C and supports supply voltages from 3.3V to 18V. Its compact design includes a 48-terminal chip carrier with no lead terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,146 parts In-Stock

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8,146

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Anansix

USA . 1,868 parts In-Stock

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1,868

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Digiode

USA . 1,664 parts In-Stock

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1,664

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Distributors (Availability)

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Native Components

USA . 742 parts In-Stock

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$0.632

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742

$0.632

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Northwest PG Solutions

USA . 1,160 parts In-Stock

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$0.696

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$0.696

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

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$3.090

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$2.781

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1,843

$3.090

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$2.781

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MKK Technologies

India . 906 parts In-Stock

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$5.811

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906

$5.811

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DigiPath Technology Company

USA . 906 parts In-Stock

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$5.811

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906

$5.811

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AZTECH Wire

Italy . 764 parts In-Stock

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$10.510

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764

$10.510

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Component Stockers USA

USA . 2,627 parts In-Stock

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$47.920

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2,627

$47.920

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Microchip USA

USA . 4,687 parts In-Stock

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Corphita

USA . 1,511 parts In-Stock

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Parana Technologies

USA . 365 parts In-Stock

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$3.695

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365

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$3.695

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Overview

Elevate your audio experience with the FDA903Q-V0T from STMicroelectronics, a cutting-edge Class D audio amplifier designed for exceptional performance and reliability. Built to withstand extreme conditions, this compact, surface-mount IC guarantees superior sound quality in automotive and consumer applications. Trust in ST's renowned engineering excellence, ensuring you enjoy clear, powerful audio while optimizing energy efficiency. Transform your projects today!

Feature Benefit Bullets

Surface Mount: YES

This surface-mount design allows for efficient use of PCB space, facilitating compact and flexible system designs.

Screening Level: AEC-Q100

Meeting the AEC-Q100 standard indicates reliability and suitability for automotive applications, ensuring long-term performance in demanding environments.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, providing easier integration into various layouts.

General IC Type: CLASS D AUDIO AMPLIFIER

As a Class D audio amplifier, it offers high efficiency and reduced heat generation, making it ideal for battery-operated devices.

No. of Terminals: 48

A higher number of terminals allows for more comprehensive connectivity options and advanced functionalities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile combined with a heat sink enables effective heat dissipation while maintaining a compact footprint in design.

Maximum Operating Temperature: 125 °C

With a max operating temperature of 125 °C, this amplifier can function reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Operational capability down to -40 °C makes this product suitable for extreme environmental conditions, such as automotive and industrial applications.

Terminal Position: QUAD

The quad terminal layout aids in improved thermal and electrical performance, facilitating better signal integrity.

Maximum Seated Height: 1.05 mm

A low seated height ensures that the device can fit into very space-conscious designs without compromising performance.

Width: 7 mm

A standard width of 7 mm provides compatibility with various mounting systems and PCB layouts.

Minimum Supply Voltage (Vsup): 3.3 V

Operating with a minimum supply voltage of 3.3 V allows for flexibility in powering devices, suitable for low-voltage applications.

Length: 7 mm

The length of 7 mm complements the square package design, making it easy to integrate into various device layouts.

Terminal Form: NO LEAD

The no-lead terminal form enhances soldering reliability and is advantageous for automated assembly processes.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm ensures compatibility with densely packed PCB layouts, allowing for more components in smaller spaces.

Maximum Supply Voltage (Vsup): 18 V

A maximum supply voltage of 18 V provides versatility in application, ensuring the amplifier can support a range of audio output requirements.

Technical Specifications

Audio & Video Amplifiers FDA903Q-V0T attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.05 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

FDA903Q-V0T General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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