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FDA903U-KBX

STMicroelectronics

FDA903U-KBX by STMicroelectronics

FDA903U-KBX by STMicroelectronics is a Class D audio amplifier with 80W output power and low harmonic distortion of 0.01%. It operates in extreme temperatures from -40 °C to 125 °C, making it ideal for automotive applications. Its compact design features a dual terminal layout for efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,476 parts In-Stock

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5,476

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Anansix

USA . 2,573 parts In-Stock

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2,573

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Digiode

USA . 183 parts In-Stock

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183

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,197 parts In-Stock

1+ parts

$1.407

100+ parts

-

1k+ parts

$1.266

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1,197

$1.407

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$1.266

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Native Components

USA . 444 parts In-Stock

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$1.950

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444

$1.950

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Northwest PG Solutions

USA . 2,115 parts In-Stock

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$2.145

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2,115

$2.145

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MKK Technologies

India . 1,856 parts In-Stock

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$2.645

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1,856

$2.645

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DigiPath Technology Company

USA . 1,856 parts In-Stock

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$2.645

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$2.645

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Vigor

Singapore . 370 parts In-Stock

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$3.440

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370

$3.440

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AZTECH Wire

Italy . 481 parts In-Stock

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$20.150

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481

$20.150

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Microchip USA

USA . 3,373 parts In-Stock

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$25.526

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3,373

$25.526

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,871 parts In-Stock

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1,871

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Parana Technologies

USA . 241 parts In-Stock

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$1.682

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241

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$1.682

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Overview

Unlock superior audio performance with the FDA903U-KBX from STMicroelectronics, a trusted leader in innovative technology. This Class D audio amplifier seamlessly combines high efficiency with exceptional sound quality, ensuring crystal-clear audio for your applications—from home theater systems to automotive sound systems. With AEC-Q100 certification and robust thermal stability, you can rely on its durability and outstanding performance in any environment, making it the ideal choice for discerning customers who demand excellence. Experience the difference that precision engineering brings to your audio experience!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and provides excellent protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact PCB designs, enhancing assembly efficiency and reducing the overall footprint of the device.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates that this amplifier meets strict automotive qualifications, assuring reliability and performance in automotive applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for optimized space utilization on the PCB, promoting better layout flexibility.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D amplifiers are known for their high efficiency and low heat generation, which makes this product an excellent choice for power-sensitive applications.

Harmonic Distortion: 0.01 %

A low harmonic distortion value ensures high-quality audio output, making this amplifier suitable for high-fidelity audio applications.

No. of Terminals: 36

Having 36 terminals facilitates flexible connections for more complex designs and provides ease of integration with other components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This compact package style is optimized for thermal management, which is essential for maintaining performance under load.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this amplifier is suitable for use in environments where heat is a concern, enhancing design flexibility.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this amplifier suitable for outdoor and automotive applications, enhancing reliability in harsh conditions.

Terminal Position: DUAL

Dual terminal positioning allows for more versatile PCB design options and connections, improving integration possibilities.

Nominal Output Power: 80 W

A nominal output power of 80 W provides robust audio amplification suitable for a wide range of audio applications, ensuring a rich listening experience.

Maximum Seated Height: 2.45 mm

The low maximum seated height allows for compact designs and can be beneficial in thin devices where space is a premium.

Width: 7.5 mm

A width of 7.5 mm enables integration into narrow spaces, enhancing the versatility of the product for various applications.

Minimum Supply Voltage (Vsup): 3.3 V

A low minimum supply voltage allows this amplifier to work efficiently with lower voltage systems, making it compatible with modern battery-operated devices.

Length: 10.3 mm

A compact length of 10.3 mm permits space-saving installations, ideal for applications with limited board area.

Technology: BCDMOS

BCDMOS technology offers high performance and efficiency, optimizing power consumption and enhancing overall amplifier performance.

Terminal Form: GULL WING

Gull wing terminal design enhances soldering reliability and helps in maintaining stronger electrical connections during operation.

Terminal Pitch: 0.5 mm

A tight terminal pitch of 0.5 mm enables high-density packaging of components, which is important in modern electronics with limited space.

Maximum Supply Voltage (Vsup): 18 V

A maximum supply voltage of 18 V allows for flexibility and scalability in audio applications, accommodating different power requirements.

Technical Specifications

Audio & Video Amplifiers FDA903U-KBX attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

80 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

FDA903U-KBX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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