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E-L6917BD

STMicroelectronics

E-L6917BD by STMicroelectronics

E-L6917BD by STMicroelectronics is a compact switching regulator with a max input voltage of 12V and operates at up to 600 kHz. It features a dual terminal design in a small outline package, ideal for efficient power management in commercial applications. Its current-mode control ensures stable performance across temperatures from 0 °C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,819 parts In-Stock

1+ parts

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1,819

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Anansix

USA . 1,235 parts In-Stock

1+ parts

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1,235

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Digiode

USA . 1,004 parts In-Stock

1+ parts

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1,004

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 459 parts In-Stock

1+ parts

$1.000

100+ parts

-

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459

$1.000

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

1+ parts

$10.172

100+ parts

-

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$9.155

10k+ parts

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1,082

$10.172

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$9.155

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MKK Technologies

India . 1,249 parts In-Stock

1+ parts

$19.129

100+ parts

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1,249

$19.129

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DigiPath Technology Company

USA . 1,249 parts In-Stock

1+ parts

$19.129

100+ parts

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1,249

$19.129

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Corphita

USA . 2,337 parts In-Stock

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2,337

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Parana Technologies

USA . 1,268 parts In-Stock

1+ parts

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$12.163

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1,268

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$12.163

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Northwest PG Solutions

USA . 1,157 parts In-Stock

1+ parts

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$3.663

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1,157

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$3.663

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Native Components

USA . 339 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.626

10k+ parts

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339

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$3.626

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Overview

Unlock the power of efficiency with the E-L6917BD by STMicroelectronics! This cutting-edge switching regulator combines top-notch quality with exceptional performance, ideal for diverse applications ranging from consumer electronics to industrial automation. With its innovative design and reliable technology, customers benefit from reduced energy costs and enhanced system reliability. Trust in STMicroelectronics' commitment to excellence—your projects deserve nothing less!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package ensures durability and resistance to environmental factors, making this switching regulator reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuitry, enhancing space efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes the layout on PCBs, facilitating better space utilization in device design.

No. of Terminals: 28

Having 28 terminals offers flexibility in design and multiple connection options, making it versatile for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint, allowing for efficient use of board space in compact designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows for use in a variety of environments, ensuring stable performance under normal conditions.

Control Mode: CURRENT-MODE

Current-mode control provides enhanced responsiveness and stability, making this product suitable for demanding applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the device is suitable for a broader range of applications, including those in colder environments.

Terminal Position: DUAL

Dual terminal positions streamline circuit design and improve performance by allowing for better layout options on the PCB.

Maximum Seated Height: 2.65 mm

A low seated height maximizes design flexibility, making it easier to accommodate within various circuit designs without height constraints.

Width: 7.5 mm

The compact width makes it ideal for space-constrained applications, allowing easier integration into both consumer and industrial devices.

Other IC type: SWITCHING CONTROLLER

Being a switching controller means it can efficiently regulate power, crucial for energy-sensitive applications like mobile devices and power supplies.

Nominal Input Voltage: 12 V

The nominal input voltage of 12V makes it a suitable choice for standard power systems widely used in both industrial and consumer applications.

Length: 17.9 mm

The manageable length contributes to compact design possibilities, facilitating integration into small electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product is reliable under standard operating conditions typical in consumer electronics.

Maximum Switching Frequency: 600 kHz

A maximum switching frequency of 600 kHz allows for efficient power regulation and smooth operation, suitable for high-performance applications.

Technology: BCDMOS

Utilizing BCDMOS technology enhances the efficiency and performance of the switching controller, making it ideal for modern power management.

Terminal Form: GULL WING

Gull wing terminal form provides excellent mechanical strength and solderability, ensuring a robust connection on the PCB.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique ensures precise output voltage regulation, making the product ideal for stable power delivery.

Switcher Config: PHASE-SHIFT

Phase-shift configuration enhances power efficiency and reduces electromagnetic interference, critical for high-performance applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compact design and ease of soldering, simplifying manufacturing processes.

Minimum Input Voltage: 8.5 V

A minimum input voltage of 8.5V provides flexibility in power supply design, allowing for compatibility with various systems.

Technical Specifications

Switching Regulators & Controllers E-L6917BD attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

8.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

600 kHz

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

E-L6917BD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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