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E-L6911D

STMicroelectronics

E-L6911D by STMicroelectronics

E-L6911D by STMicroelectronics is a compact switching regulator designed for efficient power management. It features a voltage-mode control with a max output current of 1.3 A and operates at a frequency up to 1 MHz, ideal for various electronic applications. Its small outline package ensures easy surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,607 parts In-Stock

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3,607

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Anansix

USA . 1,100 parts In-Stock

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1,100

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Digiode

USA . 728 parts In-Stock

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728

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 124 parts In-Stock

1+ parts

$5.890

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124

$5.890

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IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$10.169

100+ parts

-

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$9.152

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670

$10.169

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$9.152

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MKK Technologies

India . 303 parts In-Stock

1+ parts

$19.122

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303

$19.122

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DigiPath Technology Company

USA . 303 parts In-Stock

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$19.122

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303

$19.122

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Corphita

USA . 4,692 parts In-Stock

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4,692

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Parana Technologies

USA . 2,102 parts In-Stock

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$12.158

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2,102

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$12.158

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Northwest PG Solutions

USA . 1,452 parts In-Stock

1+ parts

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$5.772

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1,452

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$5.772

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Overview

Elevate your designs with the E-L6911D from STMicroelectronics, a leader in innovation and reliability. This compact switching regulator delivers exceptional performance and efficiency, making it perfect for a wide range of applications from consumer electronics to industrial systems. Enjoy the benefits of enhanced power management, reduced energy consumption, and superior thermal stability, ensuring your projects not only meet but exceed expectations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances reliability and lifespan, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of board space, optimizing layout and design.

No. of Terminals: 20

20 terminals provide flexibility for connections and functionality, accommodating complex designs and applications.

Package Style (Meter): SMALL OUTLINE

Small outline packages are ideal for space-constrained applications, supporting miniaturized electronics.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers simpler design and better transient response, ensuring stable output voltage.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of soldering and improves the overall connection reliability.

Maximum Seated Height: 2.65 mm

The low seated height contributes to a slim profile, making it suitable for low-profile applications.

Width: 7.5 mm

A compact width aids in efficient space management on PCBs, allowing for more components in a limited area.

Other IC type: SWITCHING CONTROLLER

Allows for efficient power conversion and management, essential for energy-saving designs.

Nominal Input Voltage: 12 V

The standard input voltage of 12 V makes it compatible with numerous power systems and applications.

Length: 12.8 mm

A compact length facilitates fitting into densely packed designs, proving advantageous in modern electronics.

Maximum Switching Frequency: 1000 kHz

A high switching frequency enables better efficiency and smaller output filtering components.

Maximum Output Current: 1.3 A

An output current of 1.3 A supports a range of devices, making it suitable for both low and moderate power applications.

Terminal Form: GULL WING

Gull wing terminals provide good soldering characteristics, enhancing mechanical stability and electrical performance.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation allows for precise control of output voltage, making the regulator efficient and versatile.

Switcher Config: PUSH-PULL

The push-pull configuration optimizes efficiency and reduces heat generation, improving reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is suitable for modern PCB designs, ensuring compatibility with advanced manufacturing processes.

Minimum Input Voltage: 5 V

The minimum input voltage of 5 V expands the range of applications, accommodating various design requirements.

Maximum Input Voltage: 12 V

This maximum input voltage ensures compatibility with standard power supplies, making integration straightforward.

Technical Specifications

Switching Regulators & Controllers E-L6911D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

12 V

Minimum Input Voltage:

5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

1.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1000 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

E-L6911D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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