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E-L6911ETR

STMicroelectronics

E-L6911ETR by STMicroelectronics

E-L6911ETR by STMicroelectronics is a compact switching regulator designed for efficient power management. It features a max output current of 1.3 A, operates at up to 1000 kHz, and supports input voltages from 5 V to 12 V. Ideal for applications requiring precise voltage control in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,285 parts In-Stock

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3,285

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Vyrian

USA . 3,042 parts In-Stock

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3,042

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Anansix

USA . 279 parts In-Stock

1+ parts

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279

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Connector Distribution Corp

USA . 230 parts In-Stock

1+ parts

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230

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Right Parts Inc.

USA . 230 parts In-Stock

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230

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 326 parts In-Stock

1+ parts

$1.522

100+ parts

-

1k+ parts

$1.370

10k+ parts

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326

$1.522

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$1.370

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MKK Technologies

India . 1,041 parts In-Stock

1+ parts

$2.861

100+ parts

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1,041

$2.861

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DigiPath Technology Company

USA . 1,041 parts In-Stock

1+ parts

$2.861

100+ parts

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1,041

$2.861

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Corphita

USA . 3,726 parts In-Stock

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3,726

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Parana Technologies

USA . 1,982 parts In-Stock

1+ parts

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$1.819

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1,982

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$1.819

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Native Components

USA . 908 parts In-Stock

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$4.232

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908

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$4.232

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Northwest PG Solutions

USA . 165 parts In-Stock

1+ parts

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$4.275

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165

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$4.275

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Overview

Unlock the potential of your designs with the E-L6911ETR from STMicroelectronics, a leader in innovation and quality. This versatile switching regulator is engineered for efficiency, delivering reliable performance at a maximum output current of 1.3 A. Perfect for consumer electronics, automotive applications, and IoT devices, it ensures optimal power management while saving space. Elevate your projects with a solution that combines cutting-edge technology and unmatched reliability, all backed by ST's renowned expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making the product reliable for long-term applications.

Surface Mount: YES

Being surface mount compatible allows for compact PCB designs, enabling higher density of components and efficient use of space.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space and allows for easy integration into various circuit layouts.

No. of Terminals: 20

Having 20 terminals provides ample connection points for various functionalities and flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the footprint on the PCB, making it ideal for space-constrained applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control delivers stable and efficient regulation, providing reliable performance in power management.

Terminal Position: DUAL

Dual terminal positioning enhances layout versatility, allowing for multiple mounting options on the circuit board.

Maximum Seated Height: 2.65 mm

A low seated height minimizes the overall profile of the device, making it suitable for slim devices and compact applications.

Width: 7.5 mm

The compact width allows for easy placement in tight areas on the PCB, contributing to efficient use of available space.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it efficiently converts voltage levels with minimal energy loss, making it suitable for power-sensitive applications.

Nominal Input Voltage: 12 V

The nominal input voltage standardizes compatibility with common power sources, simplifying design requirements.

Length: 12.8 mm

The concise length supports space-saving designs while maintaining effective functionality and performance.

Maximum Switching Frequency: 1000 kHz

A high maximum switching frequency enables better performance and efficiency in power conversion, reducing energy waste.

Maximum Output Current: 1.3 A

With a maximum output current of 1.3 A, this product is versatile for different load requirements, suitable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and make the IC easier to handle during assembly.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation provides precise control over output voltage and current, ensuring the efficiency of power delivery.

Switcher Config: PUSH-PULL

The push-pull configuration enables efficient energy conversion, enhancing the performance of the switching regulator.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows compatibility with standard PCB layouts, simplifying the design process and assembly.

Minimum Input Voltage: 5 V

The ability to operate at a minimum input voltage of 5 V increases compatibility with a wider range of power sources.

Maximum Input Voltage: 12 V

The maximum input voltage of 12 V ensures it can efficiently handle typical input environments without compromising performance.

Technical Specifications

Switching Regulators & Controllers E-L6911ETR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

12 V

Minimum Input Voltage:

5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

1.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

1000 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

E-L6911ETR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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