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E-L6925D

STMicroelectronics

E-L6925D by STMicroelectronics

E-L6925D by STMicroelectronics is a compact switching regulator designed for efficient power management. It features a max output current of 1.2 A, operates at a nominal input voltage of 3.6 V, and supports a max switching frequency of 600 kHz. Ideal for space-constrained applications, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,461 parts In-Stock

1+ parts

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8,461

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Anansix

USA . 2,011 parts In-Stock

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2,011

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Digiode

USA . 1,992 parts In-Stock

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1,992

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 208 parts In-Stock

1+ parts

$17.900

100+ parts

-

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208

$17.900

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IDEA Electronic Components Group

UK . 1,352 parts In-Stock

1+ parts

$18.695

100+ parts

-

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$16.826

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1,352

$18.695

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$16.826

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MKK Technologies

India . 2,194 parts In-Stock

1+ parts

$35.155

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2,194

$35.155

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DigiPath Technology Company

USA . 2,194 parts In-Stock

1+ parts

$35.155

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2,194

$35.155

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Microchip USA

USA . 176 parts In-Stock

1+ parts

$37.666

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176

$37.666

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Parana Technologies

USA . 1,074 parts In-Stock

1+ parts

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$22.353

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1,074

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$22.353

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Vigor

Singapore . 952 parts In-Stock

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952

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Northwest PG Solutions

USA . 837 parts In-Stock

1+ parts

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$3.322

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837

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$3.322

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Corphita

USA . 475 parts In-Stock

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475

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Native Components

USA . 336 parts In-Stock

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$3.288

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336

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$3.288

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Overview

Elevate your designs with the E-L6925D from STMicroelectronics, a leader in innovative semiconductor solutions. This compact switching regulator delivers exceptional efficiency and reliability, perfect for powering a variety of applications from consumer electronics to industrial systems. With its robust current-mode control and impressive output capabilities, the E-L6925D ensures superior performance while saving space and energy. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protection against environmental conditions.

Surface Mount: YES

Surface mount technology allows for more compact circuit designs and efficient use of space on PCBs.

Package Shape: SQUARE

The square shape is ideal for efficient placement in tight layouts, optimizing space on the circuit board.

No. of Terminals: 8

Having eight terminals provides versatility in connectivity and supports complex circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline with a thin profile allows for a low-profile design, essential for space-constrained applications.

Control Mode: CURRENT-MODE

The current-mode control provides excellent transient response and simplifies compensation, enhancing overall performance.

Terminal Position: DUAL

Dual terminal position improves mechanical stability and facilitates easier mounting on the PCB.

Maximum Seated Height: 1.1 mm

A reduced maximum height helps in designing compact devices and improves heat dissipation.

Width: 3 mm

A narrow width supports high-density PCB layouts, making this regulator suitable for portable applications.

Other IC type: SWITCHING REGULATOR

As a switching regulator, it provides higher efficiency and reduced heat generation compared to linear regulators.

Nominal Input Voltage: 3.6 V

This nominal input voltage range is commonly used in battery-operated devices, enabling efficient power management.

Length: 3 mm

The compact length is advantageous for fitting into smaller electronic enclosures without compromising performance.

Maximum Switching Frequency: 600 kHz

A high switching frequency allows for reduced component size in the output filter, further enabling compact designs.

Maximum Output Current: 1.2 A

With a maximum output current of 1.2 A, this regulator can efficiently support a variety of load requirements.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capability and ensure strong mechanical connections on PCBs.

Switcher Config: BUCK

The buck configuration is highly efficient for stepping down voltage, making it ideal for battery-powered applications.

Terminal Pitch: 0.65 mm

A fine terminal pitch enables tighter component placement, contributing to the overall miniaturization of devices.

Minimum Input Voltage: 2.7 V

The ability to operate at a minimum input voltage of 2.7 V makes this regulator suitable for various low-voltage applications.

Maximum Input Voltage: 5.5 V

The maximum input voltage of 5.5 V allows for flexibility in applications where the input supply may vary within this range.

Technical Specifications

Switching Regulators & Controllers E-L6925D attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

1.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

600 kHz

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

E-L6925D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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