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BTA04-400T

STMicroelectronics

BTA04-400T by STMicroelectronics

STMicroelectronics BTA04-400T is a 4A TRIAC with 400V repetitive peak off-state voltage. It operates b/w -40 to 110 °C, suitable for AC power control applications. Features include 5mA DC gate trigger current and UL recognized reference standard.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,632 parts In-Stock

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4,632

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Huijzer Components

Netherlands . 2,877 parts In-Stock

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2,877

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Anansix

USA . 1,673 parts In-Stock

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1,673

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Vyrian

USA . 286 parts In-Stock

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286

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ECAB

Sweden . 227 parts In-Stock

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227

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Fibra_Brandt Electronic GMBH

Germany . 14 parts In-Stock

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Native Components

USA . 53 parts In-Stock

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$0.164

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$0.158

53

$0.164

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$0.158

Northwest PG Solutions

USA . 1,911 parts In-Stock

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$0.181

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$0.159

1,911

$0.181

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$0.159

IDEA Electronic Components Group

UK . 1,543 parts In-Stock

1+ parts

$3.380

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$3.042

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$3.380

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$3.042

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MKK Technologies

India . 1,770 parts In-Stock

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$6.356

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1,770

$6.356

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DigiPath Technology Company

USA . 1,770 parts In-Stock

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$6.356

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1,770

$6.356

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Parana Technologies

USA . 1,496 parts In-Stock

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$4.041

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1,496

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$4.041

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Corphita

USA . 701 parts In-Stock

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701

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Overview

Power up your projects with the BTA04-400T by STMicroelectronics! As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products like this 4-quadrant logic level TRIAC for a wide range of applications. Whether you're looking to control power in lighting systems or motor control applications, this TRIAC offers reliable performance and precise control. With its high-quality construction and UL recognition, you can trust that the BTA04-400T will meet your needs for efficiency and reliability. Experience the benefits of superior technology and innovation with this versatile TRIAC from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and protection for internal components.

Maximum DC Gate Trigger Current: 5 mA

Allows for precise control of the triggering of the triac.

Configuration: SINGLE

Simplified design and installation process.

Package Shape: RECTANGULAR

Easy to mount and integrate into various systems.

Terminal Form: THROUGH-HOLE

Allows for easy soldering and connection to a circuit board.

Maximum Leakage Current: 0.75 mA

Ensures low power loss when the triac is in the off state.

No. of Terminals: 3

Simplified connectivity requirements.

Package Style (Meter): FLANGE MOUNT

Provides stability and secure mounting in various applications.

Maximum Operating Temperature: 110 °C

Suitable for a wide range of operating environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Allows for bi-directional control of AC power with logic level triggering.

Minimum Operating Temperature: -40 °C

Can function effectively in extreme cold conditions.

Terminal Finish: MATTE TIN

Provides good solderability and conductivity for the terminals.

Terminal Position: SINGLE

Simplified wiring and installation process.

Maximum RMS On-state Current: 4 A

Can handle high current loads during operation.

Maximum DC Gate Trigger Voltage: 2.5 V

Low trigger voltage requirement for efficient control.

Case Connection: ISOLATED

Protects the case from electrical interference and ensures safety.

Repetitive Peak Off-state Voltage: 400 V

Suitable for a wide range of AC power applications.

Minimum Critical Rate of Rise of Commutation Voltage: 1 V/us

Ensures smooth switching between on and off states.

Minimum Critical Rate of Rise of Off-state Voltage: 10 V/us

Provides reliable off-state performance.

Maximum Holding Current: 15 mA

Ensures the triac remains in the on state during operation.

Reference Standard: UL RECOGNIZED

Compliance with safety standards for peace of mind.

Technical Specifications

Triode For Alternating Current (TRIAC) BTA04-400T attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

1 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

15 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.75 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTA04-400T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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