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BALF-CC26-05D3

STMicroelectronics

BALF-CC26-05D3 by STMicroelectronics

STMicroelectronics' BALF-CC26-05D3 RF Transformer features 1.5 dB insertion loss, 2400 GHz min cutoff frequency, and 2500 MHz max cutoff frequency. Ideal for surface mount applications in temperature range of -40 to 105°C.

Median Price

$0.174

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$0.174

20,000

-

-

-

$0.174

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 20 parts In-Stock

1+ parts

$0.126

100+ parts

-

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-

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20

$0.126

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Vyrian

USA . 1,683 parts In-Stock

1+ parts

$0.174

100+ parts

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1,683

$0.174

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Sensible Micro Corp

USA . 22,100 parts In-Stock

1+ parts

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Anansix

USA . 1,976 parts In-Stock

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1,976

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Digiode

USA . 246 parts In-Stock

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246

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Distributors (Availability)

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Native Components

USA . 531 parts In-Stock

1+ parts

$0.720

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531

$0.720

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Northwest PG Solutions

USA . 518 parts In-Stock

1+ parts

$0.791

100+ parts

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518

$0.791

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IDEA Electronic Components Group

UK . 911 parts In-Stock

1+ parts

$4.790

100+ parts

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$4.311

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911

$4.790

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$4.311

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MKK Technologies

India . 1,483 parts In-Stock

1+ parts

$9.006

100+ parts

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1,483

$9.006

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DigiPath Technology Company

USA . 1,483 parts In-Stock

1+ parts

$9.006

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1,483

$9.006

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Perfect Parts

USA . 11,200 parts In-Stock

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Continental Prestige Electronics

USA . 9,900 parts In-Stock

1+ parts

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100+ parts

$0.170

1k+ parts

$0.127

10k+ parts

$0.104

9,900

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$0.170

$0.127

$0.104

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Parana Technologies

USA . 2,165 parts In-Stock

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$5.727

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2,165

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$5.727

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Corphita

USA . 1,083 parts In-Stock

1+ parts

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1,083

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Overview

Upgrade your RF applications with the BALF-CC26-05D3 by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers high-quality RF Transformers that offer exceptional performance and reliability. Whether you're looking to improve signal efficiency or enhance connectivity, this transformer is designed to meet your needs. Say goodbye to signal loss with only 1.5 dB insertion loss and experience seamless integration with its surface mounting feature. Trust STMicroelectronics to elevate your RF projects with the BALF-CC26-05D3.

Feature Benefit Bullets

Insertion Loss: 1.5 dB

Low insertion loss ensures minimal signal loss and better signal strength, making this product suitable for high-performance RF applications.

Packing Method: TR, 7 INCH

TR packing method with 7 inch reels allows for easy handling and efficient storage, making it convenient for mass production and assembly.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105 °C ensures reliable performance even in harsh environmental conditions, making it suitable for a wide range of applications.

Minimum Cutoff Frequency: 2400 GHz

Low minimum cutoff frequency of 2400 GHz allows for effective filtering and signal processing at high frequencies, making this product ideal for advanced RF systems.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature from -40 °C ensures versatility and reliability in extreme temperature conditions, making it suitable for various environments.

Height: 0.63 mm

Low profile height of 0.63 mm enables compact and space-saving designs, making it suitable for applications with limited space constraints.

Width: 1.02 mm

Narrow width of 1.02 mm allows for dense packing and integration into tight layouts, making it suitable for applications requiring high component density.

Maximum Cutoff Frequency: 2500 MHz

High maximum cutoff frequency of 2500 MHz ensures effective signal processing and filtering at high frequencies, making this product suitable for advanced RF communication systems.

Transformer Type: RF TRANSFORMER

Specifically designed as an RF transformer, ensuring optimal performance and compatibility with RF systems, making it a reliable choice for RF applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation on PCBs, facilitating efficient assembly and reducing production time, making it a practical choice for manufacturing processes.

Length: 1.485 mm

Compact length of 1.485 mm enables space-efficient designs and flexibility in circuit layouts, making it suitable for applications with size restrictions.

Technical Specifications

RF Transformers BALF-CC26-05D3 attributes and parameters. Explore more RF Transformers devices from STMicroelectronics

Specs

Maximum Cutoff Frequency:

2500 MHz

Minimum Cutoff Frequency:

2400 GHz

Height:

.63 mm

Insertion Loss:

1.5 dB

Length:

1.485 mm

Mounting Feature:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Packing Method:

TR, 7 INCH

Transformer Type:

Width:

1.02 mm

Trade Compliance

BALF-CC26-05D3 Transformers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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